Infineon IQE N-Channel MOSFET, 310 A, 25 V Enhancement, 24-Pin TSDSO IQE006NE2LM5CGSCATMA1
- RS Stock No.:
- 260-1073
- Mfr. Part No.:
- IQE006NE2LM5CGSCATMA1
- Manufacturer:
- Infineon
Bulk discount available
View bulk pricing optionsSubtotal (1 pack of 2 units)*
PHP462.58
(exc. VAT)
PHP518.08
(inc. VAT)
FREE delivery for orders over ₱5,000.00
In Stock
- 5,950 unit(s) ready to ship from another location
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Units | Per Unit | Per Pack* |
|---|---|---|
| 2 - 8 | PHP231.29 | PHP462.58 |
| 10 - 98 | PHP208.33 | PHP416.66 |
| 100 - 248 | PHP187.42 | PHP374.84 |
| 250 - 498 | PHP168.56 | PHP337.12 |
| 500 + | PHP151.75 | PHP303.50 |
*price indicative
- RS Stock No.:
- 260-1073
- Mfr. Part No.:
- IQE006NE2LM5CGSCATMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | N | |
| Maximum Continuous Drain Current Id | 310A | |
| Maximum Drain Source Voltage Vds | 25V | |
| Series | IQE | |
| Package Type | TSDSO | |
| Mount Type | Surface | |
| Pin Count | 24 | |
| Maximum Drain Source Resistance Rds | 0.75mΩ | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | 1V | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +150°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type N | ||
Maximum Continuous Drain Current Id 310A | ||
Maximum Drain Source Voltage Vds 25V | ||
Series IQE | ||
Package Type TSDSO | ||
Mount Type Surface | ||
Pin Count 24 | ||
Maximum Drain Source Resistance Rds 0.75mΩ | ||
Channel Mode Enhancement | ||
Forward Voltage Vf 1V | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +150°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Infineon MOSFETs allows the source potential to be connected to the PCB over the thermal pad which offers several advantages, such as increased thermal capability, advanced power density or improved layout possibilities. It also have the reduced active cooling requirements and the effective layout for thermal management which are benefits at the system level.
Enabling highest power density and performance
Superior thermal performance
Optimized layout possibilities
Related links
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