Vishay SQ7414CENW Type N-Channel Single MOSFETs, 18 A, 60 V Enhancement, 8-Pin PowerPAK
- RS Stock No.:
- 653-186
- Mfr. Part No.:
- SQ7414CENW-T1_JE3
- Manufacturer:
- Vishay
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- RS Stock No.:
- 653-186
- Mfr. Part No.:
- SQ7414CENW-T1_JE3
- Manufacturer:
- Vishay
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Product Type | Single MOSFETs | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 18A | |
| Maximum Drain Source Voltage Vds | 60V | |
| Package Type | PowerPAK | |
| Series | SQ7414CENW | |
| Mount Type | PCB | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 0.028Ω | |
| Channel Mode | Enhancement | |
| Typical Gate Charge Qg @ Vgs | 25nC | |
| Minimum Operating Temperature | -55°C | |
| Maximum Gate Source Voltage Vgs | 20V | |
| Maximum Power Dissipation Pd | 62W | |
| Forward Voltage Vf | 1.2V | |
| Maximum Operating Temperature | 175°C | |
| Length | 3.4mm | |
| Height | 1.12mm | |
| Standards/Approvals | RoHS | |
| Width | 3.4mm | |
| Automotive Standard | AEC-Q101 | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Product Type Single MOSFETs | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 18A | ||
Maximum Drain Source Voltage Vds 60V | ||
Package Type PowerPAK | ||
Series SQ7414CENW | ||
Mount Type PCB | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 0.028Ω | ||
Channel Mode Enhancement | ||
Typical Gate Charge Qg @ Vgs 25nC | ||
Minimum Operating Temperature -55°C | ||
Maximum Gate Source Voltage Vgs 20V | ||
Maximum Power Dissipation Pd 62W | ||
Forward Voltage Vf 1.2V | ||
Maximum Operating Temperature 175°C | ||
Length 3.4mm | ||
Height 1.12mm | ||
Standards/Approvals RoHS | ||
Width 3.4mm | ||
Automotive Standard AEC-Q101 | ||
Vishay SQ7414CENW Series Single MOSFETs, 60V Maximum Drain Source Voltage, 18A Maximum Continuous Drain Current - SQ7414CENW-T1_JE3
This single MOSFET device is an N-channel enhancement transistor designed for power switching and regulation in PCB-mounted assemblies. It operates as a high-current switch for power conversion and load control within systems that demand thermally resilient semiconductors and industry-standard manufacturing compliance.
Features and Benefits:
• Low on-resistance 0.028Ω delivering reduced conduction losses
• 18A continuous drain current supporting high load currents
• 62W power dissipation enabling higher power handling
• 60V drain-source rating for medium-voltage designs
• Gate tolerance up to 20V allowing flexible drive levels
• Typical gate charge 25nC facilitating predictable switching behaviour
• 18A continuous drain current supporting high load currents
• 62W power dissipation enabling higher power handling
• 60V drain-source rating for medium-voltage designs
• Gate tolerance up to 20V allowing flexible drive levels
• Typical gate charge 25nC facilitating predictable switching behaviour
Applications
• Suitable for synchronous DC-DC converter switch stages
• Ideal for motor-drive low-side switching arrangements
• Used with battery-management power distribution circuits
• Can be used for high-current load switching on PCBs
• Used for automotive power modules requiring thermal ruggedness
• Ideal for motor-drive low-side switching arrangements
• Used with battery-management power distribution circuits
• Can be used for high-current load switching on PCBs
• Used for automotive power modules requiring thermal ruggedness
What thermal range can it tolerate in demanding environments?
It can function across a broad temperature span from -55°C up to 175°C, enabling use in thermally challenging conditions.
How does the device behave as a switching element regarding forward voltage?
The forward voltage is specified at 1.2V for power-switch conduction paths, which informs voltage drop and thermal design calculations.
What package and mounting type should designers expect for PCB assembly?
It is supplied in a PowerPAK surface-mount package intended for PCB mounting to support compact board layouts.
Is it suitable for automotive-grade assemblies and standards?
It conforms to AEC-Q101 requirements for semiconductor devices targeted at automotive applications.
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