Molex, 75117 2 mm Pitch Backplane Connector, Vertical, 10 Column, 8 Row, 80 Way

Subtotal (1 tube of 10 units)*

PHP79,369.03

(exc. VAT)

PHP88,893.31

(inc. VAT)

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Units
Per Unit
Per Tube*
10 +PHP7,936.903PHP79,369.03

*price indicative

RS Stock No.:
691-168
Mfr. Part No.:
75117-0118
Manufacturer:
Molex
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Brand

Molex

Product Type

Backplane Connector

Number of Contacts

80

Current

3A

Number of Columns

10

Orientation

Vertical

Voltage

120V

Number of Rows

8

Housing Material

High Temperature Thermoplastic

Pitch

2mm

Mount Type

Through Hole

Contact Material

Copper Nickel Silicon

Contact Plating

Gold

Termination Type

Press Fit

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Series

75117

COO (Country of Origin):
CN
The Molex VHDM Single-Ended Board-to-Board Stacker Receptacle is engineered for high-performance applications that require robust connectivity. Designed with an 18mm stack height and a 2.00mm pitch, this receptacle accommodates up to 80 circuits in a vertical orientation. It is suitable for board-to-board mezzanine applications, ensuring superior signal integrity with a maximum data rate of 3.125 Gbps. Constructed from high-quality materials, including a high temperature thermoplastic resin and a combination of copper-nickel-silicon alloy for optimal conductivity, the VHDM receptacle is built to withstand rigorous environments with a temperature range from -55°C to +105°C. Its Durable design includes features suitable for lead-free processes, making it a reliable choice for modern electronic assemblies.

Accommodates up to 80 circuits, ensuring extensive connectivity options

Achieves a maximum data rate of 3.125 Gbps for high-speed data transmission

Constructed with a stack height of 18mm, facilitating Compact design

Durable metal components are plated with gold and matte tin for enhanced performance and longevity

Meets low-halogen and RoHS compliance requirements, supporting eco-friendly initiatives

Designed for easy mating with compatible VHDM headers, optimising assembly processes

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