TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch Backplane Connector, Right Angle Female, 10 Column, 4 Row, 80 Way

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Subtotal (1 tube of 20 units)*

PHP30,807.98

(exc. VAT)

PHP34,504.94

(inc. VAT)

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Units
Per Unit
Per Tube*
20 - 80PHP1,540.399PHP30,807.98
100 +PHP1,494.188PHP29,883.76

*price indicative

RS Stock No.:
164-3112
Mfr. Part No.:
1469001-1
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

Backplane Connector

Number of Contacts

80

Current

700mA

Orientation

Right Angle

Number of Columns

10

Voltage

250 V ac

Number of Rows

4

Connector Gender

Female

Housing Material

Polyethylene Terephthalate

Pitch

2.5mm

Mount Type

Through Hole

Contact Material

Copper Nickel Silicon

Contact Plating

Tin over Nickel

Minimum Operating Temperature

-65°C

Termination Type

Solder

Contact Gender

Female

Maximum Operating Temperature

105°C

Standards/Approvals

No

Series

Z-PACK HM-Zd

RoHS Status: Not Applicable

COO (Country of Origin):
CN

TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector


Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating Interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

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