Vishay IGBR 1.8 Ω, 808 Thin Film Surface Mount Fixed Resistor 10 % Wire 4 W - IGBRD1800CKANCT5
- RS Stock No.:
- 475-537
- Mfr. Part No.:
- IGBRD1800CKANCT5
- Manufacturer:
- Vishay
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Subtotal (1 tape of 1 unit)*
PHP504.23
(exc. VAT)
PHP564.74
(inc. VAT)
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- Shipping from June 02, 2026
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Tape(s) | Per Tape |
|---|---|
| 1 - 9 | PHP504.23 |
| 10 - 49 | PHP408.58 |
| 50 - 99 | PHP312.92 |
| 100 + | PHP277.33 |
*price indicative
- RS Stock No.:
- 475-537
- Mfr. Part No.:
- IGBRD1800CKANCT5
- Manufacturer:
- Vishay
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Vishay | |
| Resistance | 1.8Ω | |
| Product Type | Surface Mount Fixed Resistor | |
| Resistor Type | Thin Film Resistor | |
| Technology | Thin Film | |
| Package/Case | 808 | |
| Packaging | Commercial Tape | |
| Tolerance | 10 % | |
| Voltage | 75 V | |
| Power Rating | 4W | |
| Mount Type | Wire | |
| Temperature Coefficient | ±500 ppm/°C | |
| Automotive Standard | No | |
| Pin Count | 1 | |
| Minimum Operating Temperature | -55°C | |
| Series | IGBR | |
| Maximum Operating Temperature | 200°C | |
| Standards/Approvals | Class K, Method 106, Method 107 F, Method 2032 Class H, MIL-STD-202, MIL-STD-883 | |
| Select all | ||
|---|---|---|
Brand Vishay | ||
Resistance 1.8Ω | ||
Product Type Surface Mount Fixed Resistor | ||
Resistor Type Thin Film Resistor | ||
Technology Thin Film | ||
Package/Case 808 | ||
Packaging Commercial Tape | ||
Tolerance 10 % | ||
Voltage 75 V | ||
Power Rating 4W | ||
Mount Type Wire | ||
Temperature Coefficient ±500 ppm/°C | ||
Automotive Standard No | ||
Pin Count 1 | ||
Minimum Operating Temperature -55°C | ||
Series IGBR | ||
Maximum Operating Temperature 200°C | ||
Standards/Approvals Class K, Method 106, Method 107 F, Method 2032 Class H, MIL-STD-202, MIL-STD-883 | ||
- COO (Country of Origin):
- US
The Vishay Thin Film High Power Back-Contact Resistor utilizes the excellent thermal properties of silicon to allow ultra high power rating with miniature case size for hybrid assemblies. They requires only one wire bond thus saving hybrid space. They are manufactured using Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology.
Noise reduction or elimination
Wire bondable
RoHS compliant
High power rating
Halogen and Pb free
Moisture resistant
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