Infineon HEXFET Type N-Channel MOSFET, 5.8 A, 25 V Enhancement, 3-Pin SOT-23 IRFML8244TRPBF

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PHP292.20

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PHP327.20

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20 - 20PHP14.61PHP292.20
40 - 80PHP14.416PHP288.32
100 - 180PHP12.024PHP240.48
200 - 380PHP10.86PHP217.20
400 +PHP10.61PHP212.20

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Packaging Options:
RS Stock No.:
737-7219
Distrelec Article No.:
304-45-306
Mfr. Part No.:
IRFML8244TRPBF
Manufacturer:
Infineon
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Brand

Infineon

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

5.8A

Maximum Drain Source Voltage Vds

25V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

41mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

1.25W

Typical Gate Charge Qg @ Vgs

5.4nC

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Length

3.04mm

Height

1.02mm

Standards/Approvals

No

Automotive Standard

No

Infineon HEXFET Series MOSFET, 25V Maximum Drain Source Voltage, 5.8A Maximum Continuous Drain Current - IRFML8244TRPBF


This MOSFET is a compact N-channel enhancement device designed for surface-mount power switching and signal-level control in compact electronic assemblies. It operates over a wide temperature span suitable for demanding environments and is intended for use where low conduction losses and modest power handling are required. The package supports three-pin SOT-23 mounting for space-constrained board layouts.

Features and Benefits:


• Low on-resistance 41mΩ reduces conduction losses
• Continuous drain current 5.8A supports higher load currents
• Drain-source voltage 25V enables medium-voltage switching
• Typical gate charge 5.4nC allows fast gate transitions
• Forward voltage 1.2V minimises voltage drop under load
• Maximum power dissipation 1.25W manages thermal budget

Applications


• Suitable for compact DC-DC step-down converters
• Ideal for portable power-management modules
• Used with motor drivers for small actuator control
• Can be used for battery protection and charging circuits
• Suitable for high-density consumer electronics boards

What are the thermal limits for operation?


The device is rated to function between -55°C and 150°C, enabling operation across low-temperature starts and elevated ambient conditions.

What gate voltage extremes should be avoided?


Gate-source voltage must not exceed 20V to prevent device stress or damage.

How many pins and what mounting style does it use?


It is supplied as a three-pin component intended for surface-mount assembly in a SOT-23 footprint.

What conduction and switching trade-offs does it present?


The combination of 41mΩ on-resistance and 5.4nC gate charge balances low conduction losses with moderate gate-drive requirements for efficient switching.

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