Infineon HEXFET Type P-Channel MOSFET, 4.3 A, 12 V Enhancement, 3-Pin Micro IRLML6401TRPBF
- RS Stock No.:
- 301-316
- Mfr. Part No.:
- IRLML6401TRPBF
- Manufacturer:
- Infineon
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View bulk pricing optionsSubtotal (1 pack of 5 units)*
PHP91.94
(exc. VAT)
PHP102.975
(inc. VAT)
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Last RS stock
- Plus 250 unit(s) shipping from August 31, 2026
- Final 2,020 unit(s) shipping from September 07, 2026
Units | Per Unit | Per Pack* |
|---|---|---|
| 5 - 20 | PHP18.388 | PHP91.94 |
| 25 - 95 | PHP17.838 | PHP89.19 |
| 100 - 245 | PHP17.304 | PHP86.52 |
| 250 - 495 | PHP16.788 | PHP83.94 |
| 500 + | PHP16.28 | PHP81.40 |
*price indicative
- RS Stock No.:
- 301-316
- Mfr. Part No.:
- IRLML6401TRPBF
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type P | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 4.3A | |
| Maximum Drain Source Voltage Vds | 12V | |
| Series | HEXFET | |
| Package Type | Micro | |
| Mount Type | Surface | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance Rds | 50mΩ | |
| Channel Mode | Enhancement | |
| Forward Voltage Vf | -1.2V | |
| Maximum Power Dissipation Pd | 1.3W | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 10nC | |
| Maximum Gate Source Voltage Vgs | 8V | |
| Maximum Operating Temperature | 150°C | |
| Height | 1.02mm | |
| Length | 3.04mm | |
| Standards/Approvals | No | |
| Width | 1.4mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type P | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 4.3A | ||
Maximum Drain Source Voltage Vds 12V | ||
Series HEXFET | ||
Package Type Micro | ||
Mount Type Surface | ||
Pin Count 3 | ||
Maximum Drain Source Resistance Rds 50mΩ | ||
Channel Mode Enhancement | ||
Forward Voltage Vf -1.2V | ||
Maximum Power Dissipation Pd 1.3W | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 10nC | ||
Maximum Gate Source Voltage Vgs 8V | ||
Maximum Operating Temperature 150°C | ||
Height 1.02mm | ||
Length 3.04mm | ||
Standards/Approvals No | ||
Width 1.4mm | ||
Automotive Standard No | ||
Infineon HEXFET Series MOSFET, 4.3A Maximum Continuous Drain Current, 1.3W Maximum Power Dissipation - IRLML6401TRPBF
This P-Channel MOSFET is designed for efficiency, making it suitable for applications that demand effective power management. Utilising HEXFET technology, it provides low on-resistance, resulting in reduced power loss during operation. The robust design enables it to endure high temperatures, making it suitable for environments where performance is essential.
Features & Benefits
• Advanced processing for very low on-resistance
• Maximum drain source voltage of 12V
• Continuous drain current capability of 4.3A
• Junction temperature tolerance up to 150°C
• Optimised for fast switching applications, enhancing efficiency
• Compact SOT-23 package for space-efficient circuit designs
Applications
• Battery and load management systems
• Portable electronics where low-profile components are required
• Power management solutions in PCMCIA cards
• Automation systems that require dependable switching
• Electronic circuits needing a compact surface mount design
What is the impact of higher temperatures on performance?
Higher temperatures can increase the on-resistance, potentially reducing efficiency. The device operates safely up to 150°C, maintaining functionality under challenging conditions.
How does the gate threshold voltage affect operation?
The gate threshold voltage, between 0.4V and 0.95V, indicates the minimum voltage necessary to activate the device. Staying within this range ensures effective load switching.
Is this product suited for fast-switching applications?
Yes, the MOSFET facilitates quick transitions between on and off states, reducing energy loss and enhancing circuit responsiveness.
What precautions should be taken during installation?
It’s advisable to use a suitable heat sink when operating near the maximum current rating to prevent overheating. Proper soldering techniques are recommended due to its surface mount design.
Can this device be used for high-power applications?
The device can continuously manage 4.3A; however, evaluating the specific application's power requirements and thermal management is essential for optimal performance.
Related links
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