Winbond SLC NAND 2 GB Parallel Flash Memory 63-Pin VFBGA

RS Stock No.:: 188-2555
Mfr. Part No.:: W29N02GVBIAA
Manufacturer:: Winbond

Winbond SLC NAND 2 GB Parallel Flash Memory 63-Pin VFBGA

This image is representative of the product range

Bulk discount available

Subtotal (1 tray of 210 units)*

PHP110,358.78

(exc. VAT)

PHP123,601.80

(inc. VAT)

FREE delivery for orders over ₱3,000.00

Temporarily out of stock

630 unit(s) shipping from April 16, 2026

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Units	Per Unit	Per Tray*
210 - 420	PHP525.518	PHP110,358.78
630 - 840	PHP509.752	PHP107,047.92
1050 +	PHP494.459	PHP103,836.39

*price indicative

RS Stock No.:: 188-2555
Mfr. Part No.:: W29N02GVBIAA
Manufacturer:: Winbond

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Winbond
	Memory Size	2GB
	Product Type	Flash Memory
	Interface Type	Parallel
	Package Type	VFBGA
	Pin Count	63
	Organisation	256M x 8 Bit
	Mount Type	Surface
	Cell Type	SLC NAND
	Minimum Supply Voltage	2.7V
	Maximum Supply Voltage	3.6V
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	85°C
	Standards/Approvals	No
	Width	9.1 mm
	Height	0.6mm
	Length	11.1mm
	Number of Bits per Word	8
	Number of Words	256M
	Automotive Standard	No
	Series	W29N02GV
	Maximum Random Access Time	25μs
	Supply Current	35mA

	Select all
	Brand Winbond
	Memory Size 2GB
	Product Type Flash Memory
	Interface Type Parallel
	Package Type VFBGA
	Pin Count 63
	Organisation 256M x 8 Bit
	Mount Type Surface
	Cell Type SLC NAND
	Minimum Supply Voltage 2.7V
	Maximum Supply Voltage 3.6V
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 85°C
	Standards/Approvals No
	Width 9.1 mm
	Height 0.6mm
	Length 11.1mm
	Number of Bits per Word 8
	Number of Words 256M
	Automotive Standard No
	Series W29N02GV
	Maximum Random Access Time 25μs
	Supply Current 35mA

Datasheet W29N02GVBIAA

Density : 2Gbit (Single chip solution)

Vcc : 2.7V to 3.6V

Bus width : x8

Operating temperature

Industrial: -40°C to 85°C

Single-Level Cell (SLC) technology.

Organization

Density: 2G-bit/256M-byte

Page size

2,112 bytes (2048 + 64 bytes)

Block size

64 pages (128K + 4K bytes)

Highest Performance

Read performance (Max.)

Random read: 25us

Sequential read cycle: 25ns

Write Erase performance

Page program time: 250us(typ.)

Block erase time: 2ms(typ.)

Endurance 100,000 Erase/Program Cycles(2)

10-years data retention

Command set

Standard NAND command set

Additional command support

Sequential Cache Read

Random Cache Read

Cache Program

Copy Back

Two-plane operation

Contact Winbond for OTP feature

Contact Winbond for block Lock feature

Lowest power consumption

Read: 25mA(typ.3V)

Program/Erase: 25mA(typ.3V)

CMOS standby: 10uA(typ.)

Space Efficient Packaging

48-pin standard TSOP1

63-ball VFBGA

2Gb SLC NAND Flash Memory with uniform 2KB+64B page size.

Bus Width: x8

Random Read: 25us

Page Program Time: 250us(typ.)

Block Erase Time: 2ms(typ.)

Support OTP Memory Area

Winbond SLC NAND 2 GB Parallel Flash Memory 63-Pin VFBGA

FREE delivery for orders over ₱3,000.00

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