Nexperia PCMF3USB3SZ 2-Element Uni-Directional ESD Protection Diode, 15-Pin WLCSP
- RS Stock No.:
- 153-1916
- Mfr. Part No.:
- PCMF3USB3SZ
- Manufacturer:
- Nexperia
Currently unavailable
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- RS Stock No.:
- 153-1916
- Mfr. Part No.:
- PCMF3USB3SZ
- Manufacturer:
- Nexperia
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Nexperia | |
| Direction Type | Uni-Directional | |
| Diode Configuration | Complex Array | |
| Product Type | ESD Protection Diode | |
| Minimum Breakdown Voltage Vbr | 4.5V | |
| Mount Type | Surface Mount | |
| Package Type | WLCSP | |
| Maximum Reverse Stand-off Voltage Vwm | 5V | |
| Pin Count | 15 | |
| Clamping Voltage VC | 6.5V | |
| Maximum Peak Pulse Current Ippm | 4A | |
| Test Current It | 50mA | |
| Minimum Operating Temperature | -40°C | |
| ESD Protection | Yes | |
| Number of Elements per Chip | 2 | |
| Maximum Operating Temperature | 85°C | |
| Length | 2.42mm | |
| Height | 0.38mm | |
| Width | 1.22 mm | |
| Maximum Reverse Leakage Current | 100nA | |
| Select all | ||
|---|---|---|
Brand Nexperia | ||
Direction Type Uni-Directional | ||
Diode Configuration Complex Array | ||
Product Type ESD Protection Diode | ||
Minimum Breakdown Voltage Vbr 4.5V | ||
Mount Type Surface Mount | ||
Package Type WLCSP | ||
Maximum Reverse Stand-off Voltage Vwm 5V | ||
Pin Count 15 | ||
Clamping Voltage VC 6.5V | ||
Maximum Peak Pulse Current Ippm 4A | ||
Test Current It 50mA | ||
Minimum Operating Temperature -40°C | ||
ESD Protection Yes | ||
Number of Elements per Chip 2 | ||
Maximum Operating Temperature 85°C | ||
Length 2.42mm | ||
Height 0.38mm | ||
Width 1.22 mm | ||
Maximum Reverse Leakage Current 100nA | ||
Common Mode filter for USB ports, No room for compromise, The most common Camera and display Interface used now for portable devices is the differential MIPI Interface running at RF frequencies. To allow operation at typical GSM/3G/LTE frequencies, a strong common-mode suppression over all bands and higher harmonics is needed. At the same time, a wide differential passband is needed to keep signal integrity. Since ESD can enter through gaps in the portable device, strong ESD protection is needed to avoid damage of the electronics or re-setting the system due to ESD strikes
Strong common-mode suppression > 14 dB in the range between 500 MHz and > 8 GHz
Wide passband > 2 GHz, ensuring signal integrity for all MIPI frequencies
ESD ruggedness > 15 kV contact, far exceeding IEC 61000-4-2 (8 kV contact)
Deep snap-back for optimized SoC protection against ESD strikes
Very thin package (0.5 mm max package height)
All LVDS signals needing a passband up to 2 GHz