Bergquist Hi-Flow 625 Series Thermal Interface Pad, 0.13 mm Thick, 0.88 W/mK, 25 mm, 19mm, Thermally Conductive Phase

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We don't know if this item will be back in stock, RS intend to remove it from our range soon.
RS Stock No.:
362-9676
Mfr. Part No.:
HF625-0.005-AC-104
Manufacturer:
Bergquist
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Brand

Bergquist

Product Type

Thermal Interface Pad

Thickness

0.13mm

Thermal Conductivity

0.88W/mK

Self-Adhesive

No

Trade Name

HI-FLOW625

Conductive Material

Thermally Conductive Phase Change Compound

Length

25mm

Width

19mm

Standards/Approvals

ASTM D5470, ASTM D 882A, ASTM D257, ASTM D149, ASTM D 374, ASTM D1876, ASTM D150

Colour

Green

Minimum Operating Temperature

-30°C

Maximum Operating Temperature

150°C

Series

Hi-Flow 625

COO (Country of Origin):
US

HI-FLOW phase change product


The HI-FLOW flexible replaces thermal grease. Flexible substrate on aluminium with thermal conduction properties equivalent to those of thermal grease without its drawbacks during production.

HI-FLOW 625 provides excellent thermal contact between 2 surfaces and insulation up to 4,000 V.

Products available in dry version (DRY terminals or terminals with one face coated with thermal acrylic adhesive for easy positioning (AC terminals)

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