Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.01 in Thick, 3 W/mK, 16 in, 8in, Silicone
- RS Stock No.:
- 282-6765
- Mfr. Part No.:
- GAP PAD TGP 3000, 16in x 8in x 0.01 sh
- Manufacturer:
- Bergquist
Subtotal (1 unit)*
PHP6,655.49
(exc. VAT)
PHP7,454.15
(inc. VAT)
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- Shipping from August 14, 2026
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Units | Per Unit |
|---|---|
| 1 + | PHP6,655.49 |
*price indicative
- RS Stock No.:
- 282-6765
- Mfr. Part No.:
- GAP PAD TGP 3000, 16in x 8in x 0.01 sh
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.01in | |
| Thermal Conductivity | 3W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TGP 3000 | |
| Conductive Material | Silicone | |
| Length | 16in | |
| Width | 8in | |
| Standards/Approvals | No | |
| Series | TGP 3000 | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.01in | ||
Thermal Conductivity 3W/mK | ||
Self-Adhesive Yes | ||
Trade Name TGP 3000 | ||
Conductive Material Silicone | ||
Length 16in | ||
Width 8in | ||
Standards/Approvals No | ||
Series TGP 3000 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.
Highly conformable
Designed for low-stress applications
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