Wurth Elektronik WE-PCM Series Thermal Gap Pad, 200 μm Thick, 5 W/mK, 100 mm, 100mm, Ceramic Filled Silicone Rubber

This thermal gap pad is a thin, black thermal Interface intended to improve heat transfer between electronic components and heat-dissipation surfaces. Constructed from ceramic-filled silicone rubber, it functions as a compressible Interface that accommodates uneven surfaces while conducting heat. It is suitable for use across a wide temperature range and meets chemical and material restrictions specified for contemporary electronic assemblies.

• 5W/mK conductivity increases heat removal efficiency
• Ceramic-filled silicone composition enhances thermal performance
• Operates from -40°C to 130°C, supporting harsh temperature cycles
• Halogen-free and REACH compliant reduces hazardous content exposure
• 0.2mm thickness allows minimal thermal gap accommodation

• Suitable for bridging small gaps in Compact electronic assemblies
• Ideal for heat-spreading between components and chassis
• Used with power modules requiring low-profile thermal management
• Can be used for thermal coupling in densely packed PCBs
• Suitable for retrofit cooling in enclosure assemblies

It functions reliably across an operating range from -40°C to 130°C.

A ceramic-filled silicone rubber Matrix supplies the conductive medium.

It is supplied as halogen-free and carries REACH and RoHS approvals.

The material thickness is specified at 0.2mm.

One supplied dimension is 100 x 100mm, suitable for covering moderate areas.