Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 4 W/mK, 100 mm, 100mm, Silicone with Ceramic Particles
- RS Stock No.:
- 242-0154
- Distrelec Article No.:
- 302-53-099
- Mfr. Part No.:
- 40114010
- Manufacturer:
- Wurth Elektronik
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- RS Stock No.:
- 242-0154
- Distrelec Article No.:
- 302-53-099
- Mfr. Part No.:
- 40114010
- Manufacturer:
- Wurth Elektronik
Select all | Attribute | Value |
|---|---|---|
| Brand | Wurth Elektronik | |
| Product Type | Thermal Gap Pad | |
| Thickness | 1mm | |
| Thermal Conductivity | 4W/mK | |
| Trade Name | Würth Elektronik eiSos GmbH & Co. KG | |
| Hardness | 35 Shore C | |
| Conductive Material | Silicone with Ceramic Particles | |
| Length | 100mm | |
| Standards/Approvals | Halogen Free Conform (JEDEC JS709B), REACh Approval Conform or declared ((EC) 1907/2006), RoHS Approval Compliant (2011/65/EU&2015/863), Halogen Free Conform (IEC 61249-2-21) | |
| Width | 100mm | |
| Colour | Purple | |
| Series | WE-TGF | |
| Maximum Operating Temperature | 180°C | |
| Minimum Operating Temperature | -50°C | |
| Select all | ||
|---|---|---|
Brand Wurth Elektronik | ||
Product Type Thermal Gap Pad | ||
Thickness 1mm | ||
Thermal Conductivity 4W/mK | ||
Trade Name Würth Elektronik eiSos GmbH & Co. KG | ||
Hardness 35 Shore C | ||
Conductive Material Silicone with Ceramic Particles | ||
Length 100mm | ||
Standards/Approvals Halogen Free Conform (JEDEC JS709B), REACh Approval Conform or declared ((EC) 1907/2006), RoHS Approval Compliant (2011/65/EU&2015/863), Halogen Free Conform (IEC 61249-2-21) | ||
Width 100mm | ||
Colour Purple | ||
Series WE-TGF | ||
Maximum Operating Temperature 180°C | ||
Minimum Operating Temperature -50°C | ||
Wurth Elektronik WE-TGF Series Thermal Gap Pad, 4W/mK Thermal Conductivity, Purple - 40114010
Features and Benefits:
• 35 Shore C hardness ensures manageable compressibility
• Halogen-free composition reduces hazardous halogen content
• Silicone with ceramic particles offers electrical insulation
• Wide operating range supports low and high temperature use
Applications
• Ideal for passive cooling in electronic assemblies
• Used with power modules requiring compliant interfaces
• Can be used for thermal conditioning of control electronics
• Suitable for prototyping thermal management layouts
What thickness options are available for this material?
What size is the thermal Interface material provided in?
What temperature extremes can the material withstand?
What approvals or environmental declarations accompany the product?
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