Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, Copper
- RS Stock No.:
- 881-154P
- Mfr. Part No.:
- LTG120670CT
- Manufacturer:
- Lotus Microsystems
N
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- RS Stock No.:
- 881-154P
- Mfr. Part No.:
- LTG120670CT
- Manufacturer:
- Lotus Microsystems
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Lotus Microsystems | |
| Product Type | Thermal Pad | |
| Thickness | 0.7mm | |
| Thermal Conductivity | 150W/mK | |
| Self-Adhesive | No | |
| Trade Name | LTG | |
| Conductive Material | Copper | |
| Standards/Approvals | RoHS | |
| Colour | Grey | |
| Series | LTG | |
| Maximum Operating Temperature | 150°C | |
| Minimum Operating Temperature | -65°C | |
| Select all | ||
|---|---|---|
Brand Lotus Microsystems | ||
Product Type Thermal Pad | ||
Thickness 0.7mm | ||
Thermal Conductivity 150W/mK | ||
Self-Adhesive No | ||
Trade Name LTG | ||
Conductive Material Copper | ||
Standards/Approvals RoHS | ||
Colour Grey | ||
Series LTG | ||
Maximum Operating Temperature 150°C | ||
Minimum Operating Temperature -65°C | ||
- COO (Country of Origin):
- TW
The Lotus Microsystems thermally-isolated jumper is engineered to efficiently manage heat dissipation from hot electronic components, ensuring reliability in thermal performance for sensitive applications.
High thermal conductivity for effective heat management
Electrically isolated design prevents unwanted current flow
Low coefficient of thermal expansion enhances durability
Available in standard EIA sizes for versatile integration
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