Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, Copper

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Packaging Options:
RS Stock No.:
881-154P
Mfr. Part No.:
LTG120670CT
Manufacturer:
Lotus Microsystems
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Brand

Lotus Microsystems

Product Type

Thermal Pad

Thickness

0.7mm

Thermal Conductivity

150W/mK

Self-Adhesive

No

Trade Name

LTG

Conductive Material

Copper

Standards/Approvals

RoHS

Colour

Grey

Series

LTG

Maximum Operating Temperature

150°C

Minimum Operating Temperature

-65°C

COO (Country of Origin):
TW
The Lotus Microsystems thermally-isolated jumper is engineered to efficiently manage heat dissipation from hot electronic components, ensuring reliability in thermal performance for sensitive applications.

High thermal conductivity for effective heat management

Electrically isolated design prevents unwanted current flow

Low coefficient of thermal expansion enhances durability

Available in standard EIA sizes for versatile integration

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