Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, 2 mm, 1.2mm, Copper
- RS Stock No.:
- 881-153P
- Mfr. Part No.:
- LTG080570CT
- Manufacturer:
- Lotus Microsystems
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- RS Stock No.:
- 881-153P
- Mfr. Part No.:
- LTG080570CT
- Manufacturer:
- Lotus Microsystems
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Lotus Microsystems | |
| Product Type | Thermal Pad | |
| Thickness | 0.7mm | |
| Thermal Conductivity | 150W/mK | |
| Self-Adhesive | No | |
| Trade Name | LTG | |
| Conductive Material | Copper | |
| Length | 2mm | |
| Standards/Approvals | RoHS | |
| Width | 1.2mm | |
| Colour | Grey | |
| Maximum Operating Temperature | 150°C | |
| Series | LTG | |
| Minimum Operating Temperature | -65°C | |
| Select all | ||
|---|---|---|
Brand Lotus Microsystems | ||
Product Type Thermal Pad | ||
Thickness 0.7mm | ||
Thermal Conductivity 150W/mK | ||
Self-Adhesive No | ||
Trade Name LTG | ||
Conductive Material Copper | ||
Length 2mm | ||
Standards/Approvals RoHS | ||
Width 1.2mm | ||
Colour Grey | ||
Maximum Operating Temperature 150°C | ||
Series LTG | ||
Minimum Operating Temperature -65°C | ||
- COO (Country of Origin):
- TW
The Lotus Microsystems thermal jumper is a silicon-based solution designed to enhance thermal conductivity and reliability in electronic applications. Its primary function is to guide heat away from critical components towards cooler areas without electrical connection.
High thermal conductivity enhances heat management capabilities
Silicon substrate offers a cost-effective alternative to ceramics
Excellent thermomechanical properties improve circuit reliability
RoHS compliant design meets environmental standards
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