Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, 2 mm, 1.2mm, Copper

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Packaging Options:
RS Stock No.:
881-153P
Mfr. Part No.:
LTG080570CT
Manufacturer:
Lotus Microsystems
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Brand

Lotus Microsystems

Product Type

Thermal Pad

Thickness

0.7mm

Thermal Conductivity

150W/mK

Self-Adhesive

No

Trade Name

LTG

Conductive Material

Copper

Length

2mm

Standards/Approvals

RoHS

Width

1.2mm

Colour

Grey

Maximum Operating Temperature

150°C

Series

LTG

Minimum Operating Temperature

-65°C

COO (Country of Origin):
TW
The Lotus Microsystems thermal jumper is a silicon-based solution designed to enhance thermal conductivity and reliability in electronic applications. Its primary function is to guide heat away from critical components towards cooler areas without electrical connection.

High thermal conductivity enhances heat management capabilities

Silicon substrate offers a cost-effective alternative to ceramics

Excellent thermomechanical properties improve circuit reliability

RoHS compliant design meets environmental standards

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