Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, 1.6 mm, 0.8mm, Copper

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Packaging Options:
RS Stock No.:
881-152P
Mfr. Part No.:
LTG060370CT
Manufacturer:
Lotus Microsystems
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Brand

Lotus Microsystems

Product Type

Thermal Pad

Thickness

0.7mm

Thermal Conductivity

150W/mK

Self-Adhesive

No

Trade Name

LTG

Conductive Material

Copper

Standards/Approvals

RoHS

Width

0.8mm

Length

1.6mm

Colour

Grey

Series

LTG

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

150°C

COO (Country of Origin):
TW
The Lotus Microsystems electrically-isolated SMT thermal jumper designed to enhance thermal management in electronic devices by efficiently guiding heat away from critical components.

High thermal conductivity ensures effective heat dissipation

High insulation resistance prevents electrical connectivity

Designed for precise package sizing to fit various applications

Low coefficient of thermal expansion promotes reliability

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