Lotus Microsystems LTG Series Thermal Pad, 0.8 mm Thick, 150 W/mK, 1.6 mm, 0.8mm, Copper
- RS Stock No.:
- 881-151P
- Mfr. Part No.:
- LTG060380ST
- Manufacturer:
- Lotus Microsystems
N
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- RS Stock No.:
- 881-151P
- Mfr. Part No.:
- LTG060380ST
- Manufacturer:
- Lotus Microsystems
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Lotus Microsystems | |
| Product Type | Thermal Pad | |
| Thickness | 0.8mm | |
| Thermal Conductivity | 150W/mK | |
| Self-Adhesive | No | |
| Trade Name | LTG | |
| Conductive Material | Copper | |
| Standards/Approvals | RoHS | |
| Width | 0.8mm | |
| Length | 1.6mm | |
| Colour | Grey | |
| Series | LTG | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 150°C | |
| Select all | ||
|---|---|---|
Brand Lotus Microsystems | ||
Product Type Thermal Pad | ||
Thickness 0.8mm | ||
Thermal Conductivity 150W/mK | ||
Self-Adhesive No | ||
Trade Name LTG | ||
Conductive Material Copper | ||
Standards/Approvals RoHS | ||
Width 0.8mm | ||
Length 1.6mm | ||
Colour Grey | ||
Series LTG | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 150°C | ||
- COO (Country of Origin):
- TW
The Lotus Microsystems Thermal Jumper offers a high-performance thermally conductive platform designed to enhance heat dissipation effectively from electronic components, ensuring reliability and performance in demanding applications.
High thermal conductivity facilitates superior heat management
Electrically isolated design ensures safe operation without electrical interference
Compact package sizing allows for integration in space-constrained environments
Meets RoHS compliance for environmentally responsible usage
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