Lotus Microsystems LTG Series Thermal Pad, 0.7 mm Thick, 150 W/mK, 1 mm, 0.5mm, Copper
- RS Stock No.:
- 881-150P
- Mfr. Part No.:
- LTG040270CT
- Manufacturer:
- Lotus Microsystems
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- RS Stock No.:
- 881-150P
- Mfr. Part No.:
- LTG040270CT
- Manufacturer:
- Lotus Microsystems
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Lotus Microsystems | |
| Product Type | Thermal Pad | |
| Thickness | 0.7mm | |
| Thermal Conductivity | 150W/mK | |
| Self-Adhesive | No | |
| Trade Name | LTG | |
| Conductive Material | Copper | |
| Width | 0.5mm | |
| Standards/Approvals | RoHS | |
| Length | 1mm | |
| Colour | Grey | |
| Series | LTG | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 150°C | |
| Select all | ||
|---|---|---|
Brand Lotus Microsystems | ||
Product Type Thermal Pad | ||
Thickness 0.7mm | ||
Thermal Conductivity 150W/mK | ||
Self-Adhesive No | ||
Trade Name LTG | ||
Conductive Material Copper | ||
Width 0.5mm | ||
Standards/Approvals RoHS | ||
Length 1mm | ||
Colour Grey | ||
Series LTG | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 150°C | ||
- COO (Country of Origin):
- TW
The Lotus Microsystems thermal jumper offers exceptional thermal conductivity and insulation, designed specifically to efficiently dissipate heat away from high-power components during operation.
High thermal conductivity enhances heat dissipation for critical components
Electrically isolated to prevent unwanted electrical connections
Available in multiple standard EIA sizes for versatile applications
RoHS compliant, ensuring adherence to environmental standards
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