TE Connectivity Grace Inhertia Series Vertical Board PCB Header, 10 Contact(s), 3.3 mm Pitch, 2 Row, Shrouded

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PHP16,611.97

(exc. VAT)

PHP18,605.41

(inc. VAT)

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SEA- RSPROC&C-PDP-1025
RS Stock No.:
508-291
Mfr. Part No.:
1-1971906-5
Manufacturer:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

Grace Inhertia

Current

4A

Pitch

3.3mm

Number of Contacts

10

Housing Material

Polyamide 66

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Tin Plated

Minimum Operating Temperature

30°C

Row Pitch

3.3mm

Termination Type

Solder

Tail Pin Length

3mm

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94V-0

Mating Pin Length

3.6mm

Voltage

250 V

COO (Country of Origin):
CN
The TE Connectivity precision-engineered PCB mount header offers a reliable connection for various applications, particularly in wire-to-board configurations. Its vertical orientation and robust design feature ten positions with a 3.3 mm centerline, ensuring a compact yet effective solution for your electronic needs. Fully shrouded for enhanced protection, the connector utilizes high-quality tin finish for superior conductivity and durability. Designed for easy installation, this product efficiently connects to printed circuit boards, making it ideal for modern electronic instruments requiring robust and consistent connectivity. The high operational voltage capacity means this connector can handle demanding applications, embodying both efficiency and reliability for any project.

Utilizes a natural color body for a seamless integration

Constructed from PA 66 GF housing material, ensuring low thermal expansion

Features secure mating retention for stability during operation

Offers easy alignment with locating posts to facilitate proper installation

Provides a locking window for enhanced mating retention

Adheres to industry standards with a UL flammability rating for safety

Encourages efficient heat dissipation through its compact design

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