Vishay Multiplexer, 1 CMOS Single 8:1, Multiplexer, 16-Pin TSSOP

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Subtotal (25 units, supplied on a continuous strip)*

PHP4,332.10

(exc. VAT)

PHP4,851.95

(inc. VAT)

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Units
Per Unit
25 - 45PHP173.284
50 - 245PHP162.888
250 - 495PHP148.228
500 +PHP130.438

*price indicative

Packaging Options:
RS Stock No.:
787-9092P
Mfr. Part No.:
DG508BEQ-T1-E3
Manufacturer:
Vishay
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Brand

Vishay

Logic Family

CMOS

Product Type

Multiplexer

Number of Elements per Chip

1

Pin Count

16

Output Type

TTL

Mount Type

Surface

Configuration

Single 8:1

Minimum Supply Voltage

-5V

Package Type

TSSOP

Maximum Supply Voltage

20V

Minimum Operating Temperature

-40°C

Multiplexer/Demultiplexer

Multiplexer

Maximum On State Resistance

600Ω

Maximum Operating Temperature

125°C

Height

1.05mm

Length

5.1mm

Standards/Approvals

No

Width

4.5mm

Series

DG508B

Automotive Standard

No

Vishay DG508B Series Multiplexer, Single 8:1 Configuration, 16 Pin Count - DG508BEQ-T1-E3


This multiplexer is an integrated switching device that selects one of eight input channels and presents it at a single TTL-compatible output, intended for surface-mount circuit designs. It operates across a broad bipolar supply range and is suitable for installations that require compact logic-level signal routing with CMOS input architecture.

Features and Benefits:


• Single-chip 8:1 configuration enables compact channel consolidation
• TTL-compatible output simplifies interfacing with legacy logic
• CMOS logic family reduces input leakage for accurate selection
• Operates from -5V to 20V supply voltage for flexible power schemes
• Maximum on-state resistance 600Ω supports low-level analogue signals
• Rated to 125°C maximum operating temperature for high-heat environments

Applications


• Suitable for multiplexing sensor arrays in industrial controllers
• Ideal for routing audio or low-voltage analogue signals
• Used with mixed-voltage logic systems requiring TTL outputs
• Can be used for signal selection in test and measurement equipment
• Useful in compact surface-mounted electronic modules

What package type should designers allow for when laying out the board?


The device is supplied in a thin-shrink TSSOP package with 16 pins, so pad geometry must match a 16-pin TSSOP footprint.

How does the temperature range affect placement near heat sources?


It tolerates continuous operation from -40°C up to 125°C, permitting placement closer to warmer components while maintaining function.

Can the device be used in automotive electronic systems?


No, it is not specified to meet automotive-grade standards and should not be used where automotive qualification is required.

What mounting method is required for assembly processes?


It is designed for surface mounting and is compatible with standard reflow soldering on printed circuit boards.

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