Vishay DG2034EDN-T1-GE4 Multiplexer, 4 Single 4:1, Multiplexer, 12-Pin QFN

This image is representative of the product range

Currently unavailable
Sorry, we don't know when this will be back in stock.
RS Stock No.:
164-7564
Mfr. Part No.:
DG2034EDN-T1-GE4
Manufacturer:
Vishay
Find similar products by selecting one or more attributes.
Select all

Brand

Vishay

Product Type

Multiplexer

Number of Elements per Chip

4

Pin Count

12

Configuration

Single 4:1

Mount Type

Surface

Package Type

QFN

Minimum Supply Voltage

1.8V

Maximum Supply Voltage

5.5V

Multiplexer/Demultiplexer

Multiplexer

Maximum On State Resistance

11Ω

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Standards/Approvals

RoHS

Width

3mm

Series

DG2034E

Height

1mm

Length

3mm

Automotive Standard

No

Vishay DG2034E Series Multiplexer, 3mm Length, 1mm Height - DG2034EDN-T1-GE4


This multiplexer is a compact analogue switch device designed to route one of four inputs to a single output in electronic systems. Intended for surface-mount assembly, it operates across a range of supply voltages and temperatures suitable for many commercial and industrial circuits. The package is small and low-profile, enabling dense board layouts while supporting multi-channel signal selection without automotive-level certification.

Features and Benefits:


• Operates from 1.8V to 5.5V enabling flexible supply choices
• Maximum on-state resistance of 11Ω minimises signal loss
• Twelve electrical pins for straightforward PCB integration
• Four elements per chip reduce component count on boards
• Maximum ambient rating of 85°C supports warm operating conditions

Applications


• Suitable for multiplexing analogue sensors in instrumentation
• Used with data acquisition front-ends requiring signal routing
• Ideal for switching signals in compact consumer electronics
• Can be used for channel selection in audio routing circuits

What mounting method is required for this device?


It is designed for surface-mount installation onto compatible pads and reflow soldering processes.

How does the package size affect PCB real-estate?


The device adopts a 3x3mm QFN footprint and low 1mm height, permitting tight component placement and reduced board area.

What thermal limits should designers consider during layout?


The component is specified to operate down to -40°C and up to 85°C, so thermal management should account for elevated ambient temperatures and nearby heat sources.

Is this suitable for automotive applications?


It does not carry automotive-grade classification and should not be selected where automotive-specific approvals are required.

Related links

Be the first to know about our latest products and offers

Email address

The personal information you provide to us when signing up to this mailing list will be processed in line with the Privacy Policy