Infineon HEXFET Type N-Channel MOSFET, 4.1 A, 20 V Enhancement, 3-Pin SOT-23 IRLML6246TRPBF

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PHP264.30

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PHP296.02

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  • Plus 2,080 unit(s) shipping from August 17, 2026
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20 - 20PHP13.215PHP264.30
40 - 80PHP12.818PHP256.36
100 - 180PHP12.433PHP248.66
200 - 380PHP12.06PHP241.20
400 +PHP11.698PHP233.96

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Packaging Options:
RS Stock No.:
737-7221
Distrelec Article No.:
304-45-317
Mfr. Part No.:
IRLML6246TRPBF
Manufacturer:
Infineon
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Brand

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

4.1A

Maximum Drain Source Voltage Vds

20V

Package Type

SOT-23

Series

HEXFET

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

66mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

3.5nC

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

1.3W

Maximum Operating Temperature

150°C

Length

3.04mm

Height

1.02mm

Standards/Approvals

No

Automotive Standard

No

Infineon HEXFET Series MOSFET, 20V Maximum Drain Source Voltage, 4.1A Maximum Continuous Drain Current - IRLML6246TRPBF


This MOSFET is a compact N‑channel enhancement device designed for low-voltage switching in surface-mount assemblies. It operates across a wide temperature range and accepts gate-drive levels compatible with common control circuits. The package and electrical characteristics make it appropriate for space‑constrained boards requiring efficient switching performance without elevated power‑handling requirements.

Features and Benefits:


• Maximum drain-source voltage 20V enables low-voltage switching applications
• Continuous drain current 4.1A supports moderate load currents
• Low on‑resistance 66 mΩ minimises conduction losses
• Typical gate charge 3.5 nC allows faster switching transitions
• Maximum power dissipation 1.3W suits constrained thermal budgets
• Gate-source tolerance up to 12V permits robust drive margins

Applications


• Suitable for battery-management switching in portable systems
• Ideal for load switching in power-distribution modules
• Used with gate drivers in motor-control low-voltage stages
• Can be used for DC-DC converter synchronous switching
• Suitable for signal-level high-speed switching in control circuits

What thermal extremes can this device tolerate in operation?


It is specified to operate from -55 °C up to 150 °C, allowing use in environments with wide temperature fluctuations.

How does the package influence PCB layout and assembly?


The SOT‑23 surface‑mount format with three pins reduces board area and supports automated pick‑and‑place and reflow processes.

What is the expected behaviour under higher gate voltages?


The device limits gate‑source ratings to 12V maximum, so gate drives should remain within this threshold to prevent gate‑oxide stress.

How does the device perform under continuous load?


Continuous drain current is rated at 4.1A while thermal dissipation is constrained to 1.3 W, so adequate copper area or heatsinking is required to maintain safe junction temperatures.

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