Infineon BSC Type N-Channel MOSFET, 82 A, 100 V N, 8-Pin WSON BSC070N10NS5SCATMA1
- RS Stock No.:
- 258-0690
- Mfr. Part No.:
- BSC070N10NS5SCATMA1
- Manufacturer:
- Infineon
This image is representative of the product range
Bulk discount available
Subtotal (1 pack of 2 units)*
PHP355.94
(exc. VAT)
PHP398.66
(inc. VAT)
FREE delivery for orders over ₱3,000.00
In Stock
- Plus 3,820 unit(s) shipping from December 29, 2025
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Units | Per Unit | Per Pack* |
|---|---|---|
| 2 - 8 | PHP177.97 | PHP355.94 |
| 10 - 98 | PHP160.305 | PHP320.61 |
| 100 - 248 | PHP131.90 | PHP263.80 |
| 250 - 498 | PHP128.755 | PHP257.51 |
| 500 + | PHP108.555 | PHP217.11 |
*price indicative
- RS Stock No.:
- 258-0690
- Mfr. Part No.:
- BSC070N10NS5SCATMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 82A | |
| Maximum Drain Source Voltage Vds | 100V | |
| Package Type | WSON | |
| Series | BSC | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 15mΩ | |
| Channel Mode | N | |
| Forward Voltage Vf | 1.2V | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 82A | ||
Maximum Drain Source Voltage Vds 100V | ||
Package Type WSON | ||
Series BSC | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 15mΩ | ||
Channel Mode N | ||
Forward Voltage Vf 1.2V | ||
Standards/Approvals No | ||
Automotive Standard No | ||
The Infineon OptiMOS 5 100 V power MOSFETs in SuperSO8 DSC package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint. SuperSO8 DSC allows excellent thermal performance with two paths for heat dissipation. About 30% of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB.
Lower conduction losses and switching losses for higher system efficiency
Improved heat dissipation for high power density and improved reliability
Superior power handling capability and ruggedness for longer lifetime
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