Infineon BSC Type N-Channel MOSFET, 82 A, 100 V N, 8-Pin WSON
- RS Stock No.:
- 258-0689
- Mfr. Part No.:
- BSC070N10NS5SCATMA1
- Manufacturer:
- Infineon
This image is representative of the product range
Bulk discount available
Subtotal (1 reel of 4000 units)*
PHP295,288.00
(exc. VAT)
PHP330,724.00
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Temporarily out of stock
- Shipping from May 25, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit | Per Reel* |
|---|---|---|
| 4000 - 4000 | PHP73.822 | PHP295,288.00 |
| 8000 - 8000 | PHP71.607 | PHP286,428.00 |
| 12000 + | PHP68.743 | PHP274,972.00 |
*price indicative
- RS Stock No.:
- 258-0689
- Mfr. Part No.:
- BSC070N10NS5SCATMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Product Type | MOSFET | |
| Channel Type | Type N | |
| Maximum Continuous Drain Current Id | 82A | |
| Maximum Drain Source Voltage Vds | 100V | |
| Series | BSC | |
| Package Type | WSON | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 15mΩ | |
| Channel Mode | N | |
| Forward Voltage Vf | 1.2V | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Product Type MOSFET | ||
Channel Type Type N | ||
Maximum Continuous Drain Current Id 82A | ||
Maximum Drain Source Voltage Vds 100V | ||
Series BSC | ||
Package Type WSON | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 15mΩ | ||
Channel Mode N | ||
Forward Voltage Vf 1.2V | ||
Standards/Approvals No | ||
Automotive Standard No | ||
The Infineon OptiMOS 5 100 V power MOSFETs in SuperSO8 DSC package offer all thermal management benefits of dual-side cooling solutions with industry-standard footprint. SuperSO8 DSC allows excellent thermal performance with two paths for heat dissipation. About 30% of the heat generated on the MOSFET die is transferred through the top and less heat is transferred to the PCB.
Lower conduction losses and switching losses for higher system efficiency
Improved heat dissipation for high power density and improved reliability
Superior power handling capability and ruggedness for longer lifetime
Related links
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