Infineon IMLT65 Type N-Channel MOSFET, 82 A, 650 V Enhancement, 16-Pin PG-HDSOP-16 IMLT65R026M2HXTMA1
- RS Stock No.:
- 351-947
- Mfr. Part No.:
- IMLT65R026M2HXTMA1
- Manufacturer:
- Infineon
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PHP1,100.56
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PHP1,232.63
(inc. VAT)
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Units | Per Unit |
|---|---|
| 1 - 9 | PHP1,100.56 |
| 10 - 99 | PHP990.59 |
| 100 + | PHP913.79 |
*price indicative
- RS Stock No.:
- 351-947
- Mfr. Part No.:
- IMLT65R026M2HXTMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 82A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Output Power | 365W | |
| Package Type | PG-HDSOP-16 | |
| Series | IMLT65 | |
| Mount Type | Surface | |
| Pin Count | 16 | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Width | 10.3 mm | |
| Length | 10.1mm | |
| Standards/Approvals | JEDEC | |
| Height | 2.35mm | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 82A | ||
Maximum Drain Source Voltage Vds 650V | ||
Output Power 365W | ||
Package Type PG-HDSOP-16 | ||
Series IMLT65 | ||
Mount Type Surface | ||
Pin Count 16 | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Width 10.3 mm | ||
Length 10.1mm | ||
Standards/Approvals JEDEC | ||
Height 2.35mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Infineon CoolSiC MOSFET discrete Generation 2 (G2) in TOLT leverages the G2 best-in-class switching performance while enabling all the benefits of top-side cooling. Complementing the Q-DPAK package, it is now possible to implement a total discrete top-side cooling solution, obtaining better thermal performance, system cost reduction and simplification, and a cheaper assembly.
Enables BOM savings
Highest reliability
Enables top efficiency and power density
Simplifies assembly and cooling
Liquid cooling ready
Allows designs without fan or heatsink
Lower stray inductances
Better gate control
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