Infineon CoolSiC Type N-Channel MOSFET, 26 A, 2000 V Enhancement, 4-Pin PG-TO-247-4-PLUS-NT14 IMYH200R100M1HXKSA1
- RS Stock No.:
- 349-114
- Mfr. Part No.:
- IMYH200R100M1HXKSA1
- Manufacturer:
- Infineon
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Units | Per Unit |
|---|---|
| 1 - 9 | PHP1,180.40 |
| 10 - 99 | PHP1,062.24 |
| 100 + | PHP979.70 |
*price indicative
- RS Stock No.:
- 349-114
- Mfr. Part No.:
- IMYH200R100M1HXKSA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 26A | |
| Maximum Drain Source Voltage Vds | 2000V | |
| Package Type | PG-TO-247-4-PLUS-NT14 | |
| Series | CoolSiC | |
| Mount Type | Through Hole | |
| Pin Count | 4 | |
| Maximum Drain Source Resistance Rds | 142mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 55nC | |
| Maximum Power Dissipation Pd | 217W | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 26A | ||
Maximum Drain Source Voltage Vds 2000V | ||
Package Type PG-TO-247-4-PLUS-NT14 | ||
Series CoolSiC | ||
Mount Type Through Hole | ||
Pin Count 4 | ||
Maximum Drain Source Resistance Rds 142mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 55nC | ||
Maximum Power Dissipation Pd 217W | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
Infineon CoolSiC Series MOSFET, 2000V Drain Source Voltage, 26A Continuous Drain Current - IMYH200R100M1HXKSA1
This MOSFET is a silicon carbide N-channel enhancement device designed for high-voltage switching in demanding electronic systems. It provides a robust solution for converting or controlling large voltages and currents in through-hole implementations, operating across an extended ambient temperature range for use in harsh environments.
Features and Benefits:
• 2000V drain-to-source withstand simplifies high-voltage designs
• 26A continuous drain current supports sustained power delivery
• 217W maximum power dissipation aids thermal margin planning
• 142 mΩ Rds(on) reduces conduction losses under load
• 55 nC typical gate charge enables manageable drive energy
• Through-hole PG-TO-247-4-PLUS-NT14 package eases mounting and cooling
• 26A continuous drain current supports sustained power delivery
• 217W maximum power dissipation aids thermal margin planning
• 142 mΩ Rds(on) reduces conduction losses under load
• 55 nC typical gate charge enables manageable drive energy
• Through-hole PG-TO-247-4-PLUS-NT14 package eases mounting and cooling
Applications
• Suitable for high-voltage power converters and inverters
• Ideal for industrial motor drive power stages
• Used with energy storage and grid-tie interface circuits
• Can be used for high-voltage test and measurement equipment
• Appropriate for traction and heavy-duty power electronics modules
• Ideal for industrial motor drive power stages
• Used with energy storage and grid-tie interface circuits
• Can be used for high-voltage test and measurement equipment
• Appropriate for traction and heavy-duty power electronics modules
What voltage and polarity rating should designers expect for switching?
The device is rated to withstand 2000V between drain and source and is configured as an N-channel transistor, so designs must account for high-voltage clearance and appropriate gate-drive referencing.
How does gate-drive energy influence gate driver selection?
With a typical gate charge of 55 nC, gate drivers should be chosen to supply sufficient peak current to achieve the required switching speed while controlling dv/dt to limit electromagnetic stress.
What thermal considerations are necessary for reliable operation?
The component dissipates up to 217W under specified conditions, so thermal management including heatsinking and PCB thermal conductance must be engineered to maintain junction temperatures within limits.
Which mounting approach does the package support and what are the implications?
The PG-TO-247-4-PLUS-NT14 through-hole format facilitates mechanical stability and direct heatsink attachment, simplifying assembly for high-power applications.
Related links
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