Infineon CoolSiC MOSFET 650 V G1 Type N-Channel MOSFET, 196 A, 650 V Enhancement, 8-Pin PG-HSOF-8 IMT65R022M1HXUMA1
- RS Stock No.:
- 284-713
- Mfr. Part No.:
- IMT65R022M1HXUMA1
- Manufacturer:
- Infineon
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- RS Stock No.:
- 284-713
- Mfr. Part No.:
- IMT65R022M1HXUMA1
- Manufacturer:
- Infineon
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 196A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Package Type | PG-HSOF-8 | |
| Series | CoolSiC MOSFET 650 V G1 | |
| Mount Type | Surface | |
| Pin Count | 8 | |
| Maximum Drain Source Resistance Rds | 30mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Power Dissipation Pd | 375W | |
| Maximum Gate Source Voltage Vgs | 23 V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS Compliant | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 196A | ||
Maximum Drain Source Voltage Vds 650V | ||
Package Type PG-HSOF-8 | ||
Series CoolSiC MOSFET 650 V G1 | ||
Mount Type Surface | ||
Pin Count 8 | ||
Maximum Drain Source Resistance Rds 30mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Power Dissipation Pd 375W | ||
Maximum Gate Source Voltage Vgs 23 V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS Compliant | ||
Automotive Standard No | ||
The Infineon CoolSiC MOSFET 650 V G1 represents a significant advancement in power electronics, engineered with cutting edge silicon carbide technology to enhance performance and reliability. This innovative device boasts optimised switching characteristics, allowing for high efficiency in demanding applications. It excels in challenging environments, offering superior heat resistance and reliability beyond traditional silicon devices. Its versatility enables seamless integration into various systems, including telecommunications, renewable energy, and electric vehicle charging. Designed for exceptional thermal management, it ensures long term performance while reducing overall system footprint. The CoolSiC MOSFET stands as an Ideal solution for modern power conversion, supporting efforts towards energy efficient and Compact designs.
Optimised switching for system efficiency
Compatible with standard driver configurations
Effective in high temperature environments
Reduced switching losses with Kelvin source
Reliable fast body diode design
Supports hard commutation topologies
Improves efficiency and reduces costs
Qualified per JEDEC standards
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