Amphenol Communications Solutions 0.5 mm Pitch 262 Way, Right Angle Surface Mount DDR5 DIMM Socket ,250V ac, 500mA
- RS Stock No.:
- 263-3684P
- Mfr. Part No.:
- 10157591-002RHLF
- Manufacturer:
- Amphenol Communications Solutions
This image is representative of the product range
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 263-3684P
- Mfr. Part No.:
- 10157591-002RHLF
- Manufacturer:
- Amphenol Communications Solutions
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Insertion/Removal Method | Latched | |
| Orientation | Right Angle | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 262 | |
| Pitch | 0.5mm | |
| Mount Type | Surface | |
| Housing Material | Liquid Crystal Polymer | |
| SDRAM Type | DDR5 | |
| Minimum Operating Temperature | -40°C | |
| Latching | Yes | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS | |
| Maximum Contact Resistance | 1mΩ | |
| Series | 10157591 | |
| Voltage | 250V ac | |
| Select all | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Insertion/Removal Method Latched | ||
Orientation Right Angle | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 262 | ||
Pitch 0.5mm | ||
Mount Type Surface | ||
Housing Material Liquid Crystal Polymer | ||
SDRAM Type DDR5 | ||
Minimum Operating Temperature -40°C | ||
Latching Yes | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS | ||
Maximum Contact Resistance 1mΩ | ||
Series 10157591 | ||
Voltage 250V ac | ||
- COO (Country of Origin):
- CN
The Amphenol DDR5 SO-DIMM connectors deliver high speed and bandwidth. Being half the size of regular DIMMs, it consume lower power and promote better thermal management.
Withstands high temperature IR flow
LCP, halogen free, housing material
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