Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket

RS Stock No.:: 182-2753
Mfr. Part No.:: 74221-101LF
Manufacturer:: Amphenol Communications Solutions

Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket

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Subtotal (1 unit)*

PHP2,443.44

(exc. VAT)

PHP2,736.65

(inc. VAT)

Add 2 units to get free delivery

Orders below PHP3,000.00 (exc. VAT) cost PHP150.00.

Temporarily out of stock

Shipping from July 20, 2026

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Units	Per Unit
1 - 9	PHP2,443.44
10 - 24	PHP2,370.13
25 - 49	PHP2,299.02
50 - 99	PHP2,230.04
100 +	PHP2,163.14

*price indicative

RS Stock No.:: 182-2753
Mfr. Part No.:: 74221-101LF
Manufacturer:: Amphenol Communications Solutions

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Amphenol Communications Solutions
	IC Socket Type	Prototyping Socket
	Product Type	IC Socket
	Package Type	Surface Mount
	Number of Contacts	400
	Current	450mA
	Number of Rows	8
	Voltage	200 V
	Pitch	1.27mm
	Orientation	Straight
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Termination Type	Solder
	Row Pitch	1.27mm
	Minimum Operating Temperature	-55°C
	Device Mount Type	Surface
	Socket Mount Type	Surface
	Maximum Operating Temperature	85°C
	Series	Meg-Array
	Standards/Approvals	No
	Housing Material	Liquid Crystal Polymer

	Select all
	Brand Amphenol Communications Solutions
	IC Socket Type Prototyping Socket
	Product Type IC Socket
	Package Type Surface Mount
	Number of Contacts 400
	Current 450mA
	Number of Rows 8
	Voltage 200 V
	Pitch 1.27mm
	Orientation Straight
	Contact Material Copper Alloy
	Contact Plating Gold
	Termination Type Solder
	Row Pitch 1.27mm
	Minimum Operating Temperature -55°C
	Device Mount Type Surface
	Socket Mount Type Surface
	Maximum Operating Temperature 85°C
	Series Meg-Array
	Standards/Approvals No
	Housing Material Liquid Crystal Polymer

Datasheet 74221-101LF

COO (Country of Origin):: US

High density, high speed, discrete contact, array connector

Flexible ground distribution optimizes high speed signal integrity

10Gb/s differential pair performance with under 1% cross-talk

28Gb/s high speed performance documented for 4 mm and 6 mm stack height

Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market

1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space

Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility

6 PCB Stack heights: 4 mm to 14mm

8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform

High density standard BGA attachment lower assembly costs by using standard SMT processes

BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage

Patented BGA contact attachment preserves solder ball positioning

Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability

Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

Amphenol Communications Solutions 1.27 mm Pitch 400 Way Surface Mount Surface Prototyping IC Socket

Add 2 units to get free delivery

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