Molex, 501786 0.5 mm Pitch 30 Way Vertical FPC Connector, Surface Mount
- RS Stock No.:
- 691-488
- Mfr. Part No.:
- 501786-3092
- Manufacturer:
- Molex
N
Subtotal (1 reel of 900 units)*
PHP165,535.33
(exc. VAT)
PHP185,399.57
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Stocked by manufacturer
- Ready to ship from June 22, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per Unit* |
|---|---|---|
| 1 + | PHP165,535.33 | PHP183.928 |
*price indicative
- RS Stock No.:
- 691-488
- Mfr. Part No.:
- 501786-3092
- Manufacturer:
- Molex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Molex | |
| Number of Contacts | 30 | |
| Product Type | FPC Connector | |
| Contact Material | Copper Alloy | |
| Current | 0.5A | |
| Pitch | 0.5mm | |
| Mount Type | Surface Mount | |
| Termination Type | Surface Mount | |
| Orientation | Vertical | |
| Voltage | 50V | |
| Minimum Operating Temperature | -40°C | |
| Series | 501786 | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS Compliant | |
| Number of Rows | 1 | |
| Contact Plating | Gold | |
| Select all | ||
|---|---|---|
Brand Molex | ||
Number of Contacts 30 | ||
Product Type FPC Connector | ||
Contact Material Copper Alloy | ||
Current 0.5A | ||
Pitch 0.5mm | ||
Mount Type Surface Mount | ||
Termination Type Surface Mount | ||
Orientation Vertical | ||
Voltage 50V | ||
Minimum Operating Temperature -40°C | ||
Series 501786 | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS Compliant | ||
Number of Rows 1 | ||
Contact Plating Gold | ||
- COO (Country of Origin):
- JP
The Molex 0.50mm pitch Easy-On FFC or FPC-to-board connector features a vertical surface mount receptacle housing assembly without grounding terminals, includes separated gold plating for enhanced conductivity and durability, and supports 30 circuits for high-density interconnect applications.
Metal material used is copper alloy
Mating surface is plated with gold
Termination surface is plated with gold
Resin material used is liquid crystal polymer