Infineon NOR 64 MB SPI Flash Memory 8-Pin DFN, S25FL064LABNFI043

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Subtotal (1 reel of 6000 units)*

PHP466,146.00

(exc. VAT)

PHP522,084.00

(inc. VAT)

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6000 +PHP77.691PHP466,146.00

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RS Stock No.:
273-5367
Mfr. Part No.:
S25FL064LABNFI043
Manufacturer:
Infineon
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Brand

Infineon

Memory Size

64MB

Product Type

Flash Memory

Interface Type

SPI

Package Type

DFN

Pin Count

8

Organisation

8MB

Maximum Clock Frequency

108MHz

Cell Type

NOR

Minimum Supply Voltage

2.7V

Maximum Supply Voltage

3.6V

Timing Type

DDR

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Standards/Approvals

RoHS

Supply Current

20mA

Series

S25FL064L

Automotive Standard

AEC-Q100 Grade 1, AEC-Q100 Grade 2, AEC-Q100 Grade 3

Infineon S25FL064L Series Flash Memory, 64MB Memory Size, 2.7V to 3.6V Supply Voltage - S25FL064LABNFI043


This flash memory is a serial NOR device designed for high-speed non-volatile storage in demanding electronic environments. It operates across an extended temperature range for use in harsh conditions and supports SPI Interface communication with DDR timing for Faster data throughput. The device is supplied in a Compact DFN package and conforms to environmental restriction standards for material content.

Features and Benefits:


• 108MHz clock frequency delivers Faster data transfers
• 2.7V to 3.6V supply range enables flexible system power designs
• -40°C to +85°C rating supports extended environmental use
• 20mA supply current assists predictable power budgeting
• 8MB organisation provides parallel access patterns for system needs

Applications


• Suitable for automotive control units requiring wide temperature tolerance
• Ideal for industrial instrumentation needing fast SPI storage
• Used with embedded systems requiring DDR timing support
• Can be used for firmware storage in Compact DFN packages

What Interface does it use for system communication?


It communicates over an SPI Interface supporting DDR timing for improved throughput.

How is thermal performance specified for harsh environments?


It is rated to operate from -40°C up to +85°C for industrial and automotive contexts.

What package type should be planned for board layout?


The device is supplied in a DFN package requiring surface-mount design considerations.

Are there automotive quality designations available?


It meets AEC-Q100 Grade 1, Grade 2 and Grade 3 automotive standards.

What is the non-volatile capacity and organisation offered?


The memory provides 64MB total capacity with an 8MB organisation.

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