Alliance Memory NAND 32000 MB EMMC Flash Memory 153-Pin FBGA, ASFC32G31T3-51BIN
- RS Stock No.:
- 665-370
- Mfr. Part No.:
- ASFC32G31T3-51BIN
- Brand:
- Alliance Memory
Subtotal (1 unit)*
PHP1,291.52
(exc. VAT)
PHP1,446.50
(inc. VAT)
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In Stock
- 126 unit(s) ready to ship from another location
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Units | Per unit |
|---|---|
| 1 + | PHP1,291.52 |
*price indicative
- RS Stock No.:
- 665-370
- Mfr. Part No.:
- ASFC32G31T3-51BIN
- Brand:
- Alliance Memory
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Alliance Memory | |
| Memory Size | 32000MB | |
| Product Type | Flash Memory | |
| Interface Type | EMMC | |
| Package Type | FBGA | |
| Pin Count | 153 | |
| Organisation | 32G x 8 | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Width | 11.5 mm | |
| Length | 13mm | |
| Standards/Approvals | RoHS, JEDEC e·MMC 5.1 (JESD84-B51) | |
| Height | 1.2mm | |
| Automotive Standard | No | |
| Series | ASFC | |
| Supply Current | 0.06mA | |
| Select all | ||
|---|---|---|
Brand Alliance Memory | ||
Memory Size 32000MB | ||
Product Type Flash Memory | ||
Interface Type EMMC | ||
Package Type FBGA | ||
Pin Count 153 | ||
Organisation 32G x 8 | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Width 11.5 mm | ||
Length 13mm | ||
Standards/Approvals RoHS, JEDEC e·MMC 5.1 (JESD84-B51) | ||
Height 1.2mm | ||
Automotive Standard No | ||
Series ASFC | ||
Supply Current 0.06mA | ||
- COO (Country of Origin):
- DE
The Alliance Memory 32GB eMMC in a 153-ball FBGA package is a managed non-volatile storage device consisting of an integrated MMC controller and NAND flash memory within a JEDEC-defined standard BGA package. It is specifically designed as a compact memory solution for data storage and boot media. Optimized for predominantly read operations with low power consumption, it utilizes 3D TLC NAND technology and offers an optional Enhanced mode (pSLC) configuration to meet higher industrial performance demands. The device also supports industrial temperature grade specifications
3D TLC NAND base technology
Boot Operation Mode and Alternative Boot Operation Mode
Replay Protected Memory Block (RPMB)
Related links
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