TE Connectivity Dust Cap for use with Data Bus Components
- RS Stock No.:
- 677-096
- Mfr. Part No.:
- 240861-000
- Manufacturer:
- TE Connectivity
Subtotal (1 pack of 10 units)*
PHP305,830.46
(exc. VAT)
PHP342,530.12
(inc. VAT)
Stock information currently inaccessible - Please check back later
Pack(s) | Per Pack | Per Unit* |
|---|---|---|
| 1 + | PHP305,830.46 | PHP30,583.046 |
*price indicative
- RS Stock No.:
- 677-096
- Mfr. Part No.:
- 240861-000
- Manufacturer:
- TE Connectivity
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | Circular Connector Dust Cap | |
| Accessory Type | Dust Cap | |
| For Use With | Data Bus Components | |
| Material | Baked Silicone | |
| Standards/Approvals | No | |
| Series | D-600-0083 | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type Circular Connector Dust Cap | ||
Accessory Type Dust Cap | ||
For Use With Data Bus Components | ||
Material Baked Silicone | ||
Standards/Approvals No | ||
Series D-600-0083 | ||
The TE Connectivity Dust Cap Accessory is a threaded protective component designed to seal and safeguard data bus connectors in rugged environments. It helps prevent contamination from dust, moisture, and other external elements while maintaining connector integrity. The cap is compatible with threaded jacks and is commonly used in aerospace, defense, and industrial systems that follow MIL-STD-1553B standards. Its lightweight construction and secure coupling make it ideal for high-performance interconnection hardware. The accessory is part of a broader system that supports reliable multiplexing and signal transmission in mission-critical applications.
Designed for use with threaded data bus connectors
Provides environmental sealing and mechanical protection
Suitable for MIL-STD-1553B network applications
Lightweight construction for minimal impact on system weight
Compatible with high-performance interconnection systems
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