Molex, 76170 1.9 mm Pitch 3 Pair Backplane Connector, Right Angle Female, 8 Column, 9 Row, 72 Way

N
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Subtotal (1 tray of 25 units)*

PHP17,649.80

(exc. VAT)

PHP19,767.775

(inc. VAT)

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25 - 100PHP705.992PHP17,649.80
125 +PHP691.864PHP17,296.60

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RS Stock No.:
691-569
Mfr. Part No.:
76170-1038
Manufacturer:
Molex
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Brand

Molex

Product Type

Backplane Connector

Backplane Connector Type

3 Pair

Current

0.75A

Number of Contacts

72

Number of Columns

8

Orientation

Right Angle

Number of Rows

9

Voltage

30V

Connector Gender

Female

Housing Material

High Temperature Thermoplastic

Pitch

1.9mm

Mount Type

Through Hole

Contact Material

High Performance Alloy

Contact Plating

Gold over Tin

Minimum Operating Temperature

-55°C

Termination Type

Pin

Maximum Operating Temperature

85°C

Contact Gender

Male

Standards/Approvals

RoHS

Series

76170

COO (Country of Origin):
SG
The Molex impact 100 Ohm 3 Pair Right-Angle Daughtercard Receptacle is engineered to provide reliable electrical connections in Compact applications. Optimised for backplane connectivity, this receptacle caters to demanding data transmission needs, ensuring consistent performance in high-speed environments. With a robust construction featuring plated through-hole technology, it accommodates up to 72 circuits while maintaining exceptional durability across up to 200 mating cycles. It is designed to work seamlessly in various settings, including conventional, coplanar, and daughtercard configurations, making it an Ideal choice for modern electronic designs.

High-performance alloy (HPA) construction ensures durability and reliability

Lead-free materials used, complying with industry standards for environmental safety

Plated with gold and tin, ensuring excellent electrical connectivity and corrosion resistance

Features 8 columns and 72 circuits for dense circuit layouts

Right-angle orientation facilitates efficient space utilisation on PCBs

No keying to mating parts simplifies assembly

Application tooling readily available, ensuring ease of integration

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