TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch High Speed Backplane Connector, Vertical Male, 10 Column, 6 Row, 60 Way

RS Stock No.:: 679-477
Mfr. Part No.:: 6469083-2
Manufacturer:: TE Connectivity

TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch High Speed Backplane Connector, Vertical Male, 10 Column, 6 Row, 60 Way

Subtotal (1 tube of 20 units)*

PHP17,170.19

(exc. VAT)

PHP19,230.61

(inc. VAT)

Stock information currently inaccessible - Please check back later

Tube(s)	Per Tube	Per Unit*
1 +	PHP17,170.19	PHP858.51

*price indicative

RS Stock No.:: 679-477
Mfr. Part No.:: 6469083-2
Manufacturer:: TE Connectivity

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	TE Connectivity
	Backplane Connector Type	High Speed
	Product Type	Backplane Connector
	Number of Contacts	60
	Current	0.7A
	Number of Columns	10
	Orientation	Vertical
	Connector Gender	Male
	Number of Rows	6
	Voltage	250V
	Housing Material	Fibreglass Reinforced Polymer
	Pitch	2.5mm
	Mount Type	Board
	Contact Material	Phosphor Bronze
	Contact Plating	Gold
	Minimum Operating Temperature	-65°C
	Termination Type	Press Fit
	Contact Gender	Male
	Maximum Operating Temperature	105°C
	Standards/Approvals	UL 94V-0
	Series	Z-PACK HM-Zd

	Select all
	Brand TE Connectivity
	Backplane Connector Type High Speed
	Product Type Backplane Connector
	Number of Contacts 60
	Current 0.7A
	Number of Columns 10
	Orientation Vertical
	Connector Gender Male
	Number of Rows 6
	Voltage 250V
	Housing Material Fibreglass Reinforced Polymer
	Pitch 2.5mm
	Mount Type Board
	Contact Material Phosphor Bronze
	Contact Plating Gold
	Minimum Operating Temperature -65°C
	Termination Type Press Fit
	Contact Gender Male
	Maximum Operating Temperature 105°C
	Standards/Approvals UL 94V-0
	Series Z-PACK HM-Zd

Datasheet - 6469083-2

COO (Country of Origin):: CN

The TE Connectivity 60 Position High Speed Backplane Connector is a vertical PCB mount header designed for high-speed data transmission in modular systems. It features a 6-row by 10-column layout with partially shrouded housing, ensuring secure mating and alignment. This connector belongs to the Z-PACK HS3 series and supports up to 1 Gb/s data rates, making it suitable for telecom, computing, and industrial applications.

Vertical PCB mount header configuration for efficient board stacking

Partially shrouded housing with polarization for reliable mating alignment

2.5 mm centerline pitch supports high-speed signal transmission

TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch High Speed Backplane Connector, Vertical Male, 10 Column, 6 Row, 60 Way

Related links