DiodesZetex 1, 5.6 V Zener Diode 200 mW 5 % Surface 2-Pin SOD-923
- RS Stock No.:
- 182-7333
- Mfr. Part No.:
- DZ9F5V6S92-7
- Manufacturer:
- DiodesZetex
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- RS Stock No.:
- 182-7333
- Mfr. Part No.:
- DZ9F5V6S92-7
- Manufacturer:
- DiodesZetex
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | DiodesZetex | |
| Nominal Zener Voltage Vz | 5.6V | |
| Product Type | Zener Diode | |
| Mount Type | Surface | |
| Number of Elements per Chip | 1 | |
| Maximum Power Dissipation Pd | 200mW | |
| Package Type | SOD-923 | |
| Zener Type | Ultra Small | |
| Pin Count | 2 | |
| Test Current It | 5mA | |
| Maximum Zener Impedance | 200Ω | |
| Maximum Reverse Leakage Current | 1μA | |
| Zener Voltage Tolerance ± | 5% | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Length | 0.8mm | |
| Height | 0.37mm | |
| Series | DZ9F | |
| Typical Voltage Temperature Coefficient | 2.5mV/°C | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand DiodesZetex | ||
Nominal Zener Voltage Vz 5.6V | ||
Product Type Zener Diode | ||
Mount Type Surface | ||
Number of Elements per Chip 1 | ||
Maximum Power Dissipation Pd 200mW | ||
Package Type SOD-923 | ||
Zener Type Ultra Small | ||
Pin Count 2 | ||
Test Current It 5mA | ||
Maximum Zener Impedance 200Ω | ||
Maximum Reverse Leakage Current 1μA | ||
Zener Voltage Tolerance ± 5% | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Length 0.8mm | ||
Height 0.37mm | ||
Series DZ9F | ||
Typical Voltage Temperature Coefficient 2.5mV/°C | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
Diodes Incorporated offers Tight Tolerance Zener Diodes. An ion-implanted epitaxial wafer process allows tolerances as tight as ±2.0% in voltages ranging from 2.4V to 47V.
Ultra-Small Surface Mount Package
Flat-Lead, Thermally-Efficient Package Design
Exposed, Easily Visible Terminals, No X-ray Inspection of Solder Joints Required (As for DFN Packages)
Application
Voltage Regulation
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