Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.012 in Thick, 1.8 W/mK, 12 in, 12in, Silicone
- RS Stock No.:
- 282-6865
- Mfr. Part No.:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Manufacturer:
- Bergquist
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- RS Stock No.:
- 282-6865
- Mfr. Part No.:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.012in | |
| Thermal Conductivity | 1.8W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TSP 1800 | |
| Conductive Material | Silicone | |
| Length | 12in | |
| Width | 12in | |
| Standards/Approvals | No | |
| Series | TSP 1800 | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.012in | ||
Thermal Conductivity 1.8W/mK | ||
Self-Adhesive Yes | ||
Trade Name TSP 1800 | ||
Conductive Material Silicone | ||
Length 12in | ||
Width 12in | ||
Standards/Approvals No | ||
Series TSP 1800 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.
Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where