Bergquist 3500ULM Series Self-Adhesive Thermal Interface Pad, 3.1 mm Thick, 3.5 W/mK, Silicone
- RS Stock No.:
- 282-6851
- Mfr. Part No.:
- PAD TGP 3500ULMG
- Manufacturer:
- Bergquist
Subtotal (1 unit)*
PHP20,275.98
(exc. VAT)
PHP22,709.10
(inc. VAT)
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- Shipping from November 23, 2026
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Units | Per Unit |
|---|---|
| 1 + | PHP20,275.98 |
*price indicative
- RS Stock No.:
- 282-6851
- Mfr. Part No.:
- PAD TGP 3500ULMG
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 3.1mm | |
| Thermal Conductivity | 3.5W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Series | 3500ULM | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 3.1mm | ||
Thermal Conductivity 3.5W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Series 3500ULM | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist n extremely soft gap filling material with a thermal conductivity of 3.5 W per m K. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per m K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness.
Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress
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