Bergquist HC5000 Series Self-Adhesive Thermal Gap Pad, 0.1 in Thick, 5 W/mK, 16 in, 8in, Silicone
- RS Stock No.:
- 282-6831
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.1 sh
- Manufacturer:
- Bergquist
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- RS Stock No.:
- 282-6831
- Mfr. Part No.:
- GAP PAD TGP HC5000, 16in x 8in x 0.1 sh
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.1in | |
| Thermal Conductivity | 5W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | HC5000 | |
| Conductive Material | Silicone | |
| Length | 16in | |
| Standards/Approvals | No | |
| Width | 8in | |
| Series | HC5000 | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.1in | ||
Thermal Conductivity 5W/mK | ||
Self-Adhesive Yes | ||
Trade Name HC5000 | ||
Conductive Material Silicone | ||
Length 16in | ||
Standards/Approvals No | ||
Width 8in | ||
Series HC5000 | ||
RoHS Status: Exempt
The Bergquist soft and compliant gap filling material with a thermal conductivity of 5.0 W per m K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance low compression stress
Fiberglass reinforced for shear and tear resistance