Bergquist 3500UL Series Self-Adhesive Thermal Gap Pad, 3.1 mm Thick, 3.5 W/mK, 16 in, 8in, Silicone
- RS Stock No.:
- 282-6788
- Mfr. Part No.:
- GAP PAD TGP 3500ULMG (2191982)
- Manufacturer:
- Bergquist
Subtotal (1 unit)*
PHP12,357.91
(exc. VAT)
PHP13,840.86
(inc. VAT)
FREE delivery for orders over ₱3,000.00
Temporarily out of stock
- Shipping from July 09, 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per Unit |
|---|---|
| 1 + | PHP12,357.91 |
*price indicative
- RS Stock No.:
- 282-6788
- Mfr. Part No.:
- GAP PAD TGP 3500ULMG (2191982)
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 3.1mm | |
| Thermal Conductivity | 3.5W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Width | 8in | |
| Length | 16in | |
| Standards/Approvals | No | |
| Series | 3500UL | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 3.1mm | ||
Thermal Conductivity 3.5W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Width 8in | ||
Length 16in | ||
Standards/Approvals No | ||
Series 3500UL | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist is an extremely soft gap filling material with a thermal conductivity of 3.5 W per mK. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per mK filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness and or topography.
Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress
