Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.06 in Thick, 2 W/mK, 8 in, 16in, Silicone
- RS Stock No.:
- 282-6746
- Mfr. Part No.:
- GAP PAD TGP 2000, 8in x 16in x 0.06
- Manufacturer:
- Bergquist
Subtotal (1 unit)*
PHP9,140.38
(exc. VAT)
PHP10,237.23
(inc. VAT)
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- Shipping from July 07, 2026
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Units | Per Unit |
|---|---|
| 1 + | PHP9,140.38 |
*price indicative
- RS Stock No.:
- 282-6746
- Mfr. Part No.:
- GAP PAD TGP 2000, 8in x 16in x 0.06
- Manufacturer:
- Bergquist
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.06in | |
| Thermal Conductivity | 2W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TGP 2000 | |
| Conductive Material | Silicone | |
| Length | 8in | |
| Width | 16in | |
| Standards/Approvals | No | |
| Series | TGP 2000 | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.06in | ||
Thermal Conductivity 2W/mK | ||
Self-Adhesive Yes | ||
Trade Name TGP 2000 | ||
Conductive Material Silicone | ||
Length 8in | ||
Width 16in | ||
Standards/Approvals No | ||
Series TGP 2000 | ||
RoHS Status: Exempt
- COO (Country of Origin):
- US
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance