Infineon TLE5309 EVAL KIT Angle Sensor Evaluation Kit for TLE5309 E1211 angle sensor

The Infineon's XENSIVTM offers a set of different Evalkits and boards to enable fast and easy evaluation of TLE5x09 Dual Die angle sensors. This kit is based on XMC™ 4700 platform. The kit is equipped with the TLE5x09A16(D) dual die angle sensor and a FTDI chip that implements a high baud rate communication.

The kit consist of Dual Die Angle Sensors Evaluation Board
Rotation knob (3D printed) with magnet

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