Microchip 150 V 125 A Diode 2-Pin B MELF 1N5811US
- RS Stock No.:
- 333-163
- Mfr. Part No.:
- 1N5811US
- Manufacturer:
- Microchip
Subtotal (1 box of 41 units)*
PHP32,232.109
(exc. VAT)
PHP36,099.967
(inc. VAT)
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Units | Per Unit | Per Box* |
|---|---|---|
| 41 + | PHP786.149 | PHP32,232.11 |
*price indicative
- RS Stock No.:
- 333-163
- Mfr. Part No.:
- 1N5811US
- Manufacturer:
- Microchip
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Microchip | |
| Mount Type | Surface | |
| Product Type | Diode | |
| Package Type | B MELF | |
| Maximum Continuous Forward Current If | 125A | |
| Peak Reverse Repetitive Voltage Vrrm | 150V | |
| Series | 1N5811 | |
| Diode Configuration | Single | |
| Pin Count | 2 | |
| Minimum Operating Temperature | -65°C | |
| Peak Reverse Recovery Time trr | 30ns | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand Microchip | ||
Mount Type Surface | ||
Product Type Diode | ||
Package Type B MELF | ||
Maximum Continuous Forward Current If 125A | ||
Peak Reverse Repetitive Voltage Vrrm 150V | ||
Series 1N5811 | ||
Diode Configuration Single | ||
Pin Count 2 | ||
Minimum Operating Temperature -65°C | ||
Peak Reverse Recovery Time trr 30ns | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Microchip Ultrafast Recovery rectifier diode series is military qualified and is ideal for high reliability applications where a failure cannot be tolerated. The industry recognized 6.0 amp rated rectifiers with working peak reverse voltages from 50 to 150 volts are hermetically sealed with void less glass construction using an internal Category 1 metallurgical bond. These devices are available in both surface mount MELF and leaded package configurations. Microchip also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time requirements including standard, fast and ultrafast device types in both through hole and surface mount packages.
Void less hermetically sealed glass package
Quadruple layer passivation
Extremely robust construction
Void less hermetically sealed glass package
Quadruple layer passivation
Extremely robust construction
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