Quectel BG770AGLAA-N06-SGNSA RF Module 4.8V
- RS Stock No.:
- 225-1587P
- Mfr. Part No.:
- BG770AGLAA-N06-SGNSA
- Manufacturer:
- Quectel
This image is representative of the product range
Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
- RS Stock No.:
- 225-1587P
- Mfr. Part No.:
- BG770AGLAA-N06-SGNSA
- Manufacturer:
- Quectel
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Quectel | |
| Product Type | RF Module | |
| Component Type | Module, Module | |
| Sub Type | Energy Module | |
| Maximum RF Data Rate | 1119kbps | |
| Maximum Output Power | 21dBm | |
| Mount Type | Surface, Surface Mount | |
| Interface Type | UART, USB | |
| Minimum Supply Voltage | 2.6V | |
| Maximum Supply Voltage | 4.8V | |
| Minimum Operating Temperature | -35°C | |
| Maximum Operating Temperature | 75°C | |
| Standards/Approvals | No | |
| Width | 12.9mm | |
| Series | BG77 | |
| Length | 14.9mm | |
| Height | 1.7mm | |
| Select all | ||
|---|---|---|
Brand Quectel | ||
Product Type RF Module | ||
Component Type Module, Module | ||
Sub Type Energy Module | ||
Maximum RF Data Rate 1119kbps | ||
Maximum Output Power 21dBm | ||
Mount Type Surface, Surface Mount | ||
Interface Type UART, USB | ||
Minimum Supply Voltage 2.6V | ||
Maximum Supply Voltage 4.8V | ||
Minimum Operating Temperature -35°C | ||
Maximum Operating Temperature 75°C | ||
Standards/Approvals No | ||
Width 12.9mm | ||
Series BG77 | ||
Length 14.9mm | ||
Height 1.7mm | ||
- COO (Country of Origin):
- CN
The Quectel ultra-compact LPWA module supporting LTE Cat M1, LTE Cat NB2 and integrated GNSS. It is fully compliant with 3GPP Rel-14 specification and provides maximum data rates of 588 kbps downlink and 1119 kbps uplink. It features ultra-low power consumption by leveraging the integrated RAM/flash as well as the ARM Cortex A7 processor supporting ThreadX, achieving up to 70% reduction in PSM leakage and 85% reduction in eDRX current consumption compared to its predecessor. Its Advanced LGA package allows fully automated manufacturing for high-volume applications.
Robust mounting and interfaces
Supports USB 2.0 Interface
