Molex Pluggable I/O Connector ZSFP+ I/O Connector Female Pin 16 Port 320-Position, 172501-8002

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Subtotal (1 tray of 2 units)*

PHP18,370.08

(exc. VAT)

PHP20,574.49

(inc. VAT)

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Tray(s)
Per Tray
Per Unit*
1 +PHP18,370.08PHP9,185.04

*price indicative

RS Stock No.:
683-585
Mfr. Part No.:
172501-8002
Manufacturer:
Molex
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Brand

Molex

Sub Type

I/O Connector

Termination Type

Pin

Product Type

Pluggable I/O Connector

Form Factor

ZSFP+

Number of Ports

16

Current

0.5A

Orientation

Right Angle

Number of Contacts

320

Connector Gender

Female

Contact Material

High Performance Alloy

Contact Plating

Gold, Matte Tin

Voltage

30 Vrms

Housing Material

Copper Alloy

Series

172501

Contact Gender

Female

Standards/Approvals

UL Certification: E29179, IEC-62474, IPC 1752A Class C & D, REACH, RoHS, CHINA RoHS

COO (Country of Origin):
ID
The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers is expertly designed for high-speed I/O connector applications featuring a compact two-by-eight configuration that optimises airflow. This product effectively accommodates 320 circuits making it ideal for advanced electronic integration. With its robust construction that includes a high-performance alloy and thermoplastic materials this assembly ensures reliable performance across a broad operating temperature range of -40° to +85°C. The unique engineering incorporates EMI shielding to enhance data integrity while maintaining a maximum data rate of 28.0 Gbps. Accurately tailored for module to board applications this versatile receptacle guarantees ease of installation and secure connectivity.

320 circuits for enhanced connection capacity

Engineered for module to board applications providing flexibility

Includes EMI fingers for superior shielding performance

Constructed with high-performance thermoplastic and alloy materials for durability

Right angle orientation simplifies installation in compact spaces

Designed to withstand 100 mating cycles which ensuring long-term usability

PCB retention features enhance stability in electronic assemblies

Tray packaging facilitates easy handling and minimises damage during transit

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