Adaptive Peltier Module, 1.6W, 3.2A, 0.9V, 8 x 8mm
- RS Stock No.:
- 490-1200
- Mfr. Part No.:
- ET-007-10-15-RS
- Manufacturer:
- Adaptive
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PHP1,873.64
(exc. VAT)
PHP2,098.48
(inc. VAT)
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Units | Per Unit |
|---|---|
| 1 - 99 | PHP1,873.64 |
| 100 - 249 | PHP1,817.42 |
| 250 - 499 | PHP1,762.89 |
| 500 + | PHP1,710.00 |
*price indicative
- RS Stock No.:
- 490-1200
- Mfr. Part No.:
- ET-007-10-15-RS
- Manufacturer:
- Adaptive
Specifications
Technical data sheets
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Adaptive | |
| Maximum Cooling Capacity | 1.6W | |
| Maximum Temperature Difference | +74K | |
| Maximum Current | 3.2A | |
| Maximum Voltage | 0.9V | |
| Active Area | 8 x 8mm | |
| Active Area Length | 8mm | |
| Active Area Thickness | 3.8mm | |
| Active Area Width | 8mm | |
| Select all | ||
|---|---|---|
Brand Adaptive | ||
Maximum Cooling Capacity 1.6W | ||
Maximum Temperature Difference +74K | ||
Maximum Current 3.2A | ||
Maximum Voltage 0.9V | ||
Active Area 8 x 8mm | ||
Active Area Length 8mm | ||
Active Area Thickness 3.8mm | ||
Active Area Width 8mm | ||
- COO (Country of Origin):
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise
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