Phoenix Contact SPT Series PCB Terminal Block, 8-Contact, 3.5 mm Pitch, Surface, 1 Row

Subtotal (1 pack of 200 units)*

PHP46,658.04

(exc. VAT)

PHP52,257.00

(inc. VAT)

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Per Pack
Per Unit*
1 +PHP46,658.04PHP233.29

*price indicative

RS Stock No.:
556-706
Mfr. Part No.:
1824145
Manufacturer:
Phoenix Contact
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Brand

Phoenix Contact

Number of Contacts

8

Product Type

PCB Terminal Block

Pitch

3.5mm

Number of Rows

1

Current

17.5A

Minimum Wire Size mm²

0.2mm²

Housing Material

Liquid Crystal Polymer

Mount Type

Surface

Maximum Wire Size mm²

1.5mm²

Minimum Wire Size AWG

24 AWG

Maximum Wire Size AWG

16 AWG

Orientation

90°

Colour

Black

Wire Connection Method

Push-in

Voltage

160 V

Width

28.5 mm

Depth

7.7mm

Standards/Approvals

cULus Recognised, VDE

Length

13.6mm

Series

SPT

COO (Country of Origin):
PL
The Phoenix Contact printed circuit board terminal block, renowned for its robust build and innovative design, is tailored for high-performance applications. Combining functionality with user-friendly features, it seamlessly integrates into various electronic devices with a compact footprint. The SPT-SMD series showcases a versatile push-in spring connection method, allowing for swift and effective wiring. Its thoughtful design not only ensures longevity but also enhances stability during operation. Suitable for SMD soldering, this terminal block is engineered to withstand demanding conditions while delivering exceptional electrical performance. With an efficient conductor cross-section handling and a straightforward operational interface, this product provides reliability that engineers can trust.

Time-saving installation eliminates the need for additional tools

Colour-coded actuating push button simplifies operation and enhances user experience

Designed for compatibility with standard SMT soldering processes

Integrated testing option offers quick and convenient maintenance checks

Made from WEEE/RoHS-compliant materials, ensuring environmental responsibility

Low profile design with linear pad geometry optimises PCBs for space efficiency

High-quality materials enhance durability and resilience in varying climates

Effective heat dissipation capabilities protect against thermal overload

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