Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Amphenol Communications Solutions
	Product Type	PCB Socket
	Number of Contacts	40
	Sub Type	Board-to-Board
	Number of Rows	2
	Current	800mA
	Pitch	0.8mm
	Housing Material	Glass Filled Liquid Crystal Polymer
	Termination Type	Solder
	Mount Type	Surface
	Orientation	Straight
	Stacking Height	20mm
	Connector System	Board-to-Board
	Voltage	100 V
	Series	BergStak
	Minimum Operating Temperature	-40°C
	Contact Material	Copper
	Maximum Operating Temperature	125°C
	Contact Gender	Female
	Contact Plating	Gold
	Standards/Approvals	No

	Select all
	Brand Amphenol Communications Solutions
	Product Type PCB Socket
	Number of Contacts 40
	Sub Type Board-to-Board
	Number of Rows 2
	Current 800mA
	Pitch 0.8mm
	Housing Material Glass Filled Liquid Crystal Polymer
	Termination Type Solder
	Mount Type Surface
	Orientation Straight
	Stacking Height 20mm
	Connector System Board-to-Board
	Voltage 100 V
	Series BergStak
	Minimum Operating Temperature -40°C
	Contact Material Copper
	Maximum Operating Temperature 125°C
	Contact Gender Female
	Contact Plating Gold
	Standards/Approvals No

Receptacle Assembly Drawing

COO (Country of Origin):: MY

0.8mm Bergstak® Series

These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.

Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’

The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.

Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch Solder

0.8mm Bergstak® Series

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