Molex C-Grid III Series Right Angle Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

RS Stock No.:: 360-6847
Mfr. Part No.:: 90130-3208
Manufacturer:: Molex

Molex C-Grid III Series Right Angle Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Subtotal (1 pack of 5 units)*

PHP443.52

(exc. VAT)

PHP496.74

(inc. VAT)

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In Stock

Plus 35 unit(s) shipping from December 15, 2025
Plus 25 unit(s) shipping from December 22, 2025
Plus 115 unit(s) shipping from March 30, 2026

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Units	Per Unit	Per Pack*
5 - 95	PHP88.704	PHP443.52
100 - 370	PHP86.042	PHP430.21
375 - 1495	PHP83.458	PHP417.29
1500 - 2995	PHP80.954	PHP404.77
3000 +	PHP78.528	PHP392.64

*price indicative

RS Stock No.:: 360-6847
Mfr. Part No.:: 90130-3208
Manufacturer:: Molex

Specifications

Technical data sheets

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Molex
	Product Type	PCB Header
	Series	C-Grid III
	Pitch	2.54mm
	Current	3A
	Housing Material	Polyester
	Number of Contacts	8
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Connector System	Wire-to-Board
	Mount Type	Through Hole
	Contact Material	Brass
	Contact Plating	Gold
	Termination Type	Solder
	Minimum Operating Temperature	-55°C
	Row Pitch	2.54mm
	Maximum Operating Temperature	125°C
	Contact Gender	Male
	Tail Pin Length	2.9mm
	Standards/Approvals	No
	Mating Pin Length	6.75mm
	Voltage	350 V
	Distrelec Product Id	304-34-578

	Select all
	Brand Molex
	Product Type PCB Header
	Series C-Grid III
	Pitch 2.54mm
	Current 3A
	Housing Material Polyester
	Number of Contacts 8
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Connector System Wire-to-Board
	Mount Type Through Hole
	Contact Material Brass
	Contact Plating Gold
	Termination Type Solder
	Minimum Operating Temperature -55°C
	Row Pitch 2.54mm
	Maximum Operating Temperature 125°C
	Contact Gender Male
	Tail Pin Length 2.9mm
	Standards/Approvals No
	Mating Pin Length 6.75mm
	Voltage 350 V
	Distrelec Product Id 304-34-578

Molex C-Grid III Series PCB Header, 2.54mm Pitch, 8 Contacts - 90130-3208

This PCB header connector belongs to the C-Grid III series and is designed for versatile wire-to-board configurations. The dual-row, shrouded design showcases a right-angle orientation, enabling efficient space utilisation in various applications. With a pin pitch of 2.54mm, the connector supports a maximum of 8 circuits, making it suitable for demanding electronic connections.

Features & Benefits

• Features a shrouded design for enhanced protection

• Right-angle configuration optimises space in tight layouts

• Utilises gold plating for superior electrical conductivity

• Supports through hole termination for secure attachment

• Capable of handling up to 3A current per contact

• High durability rating of up to 100 mating cycles

Applications

• Ideal for automation control panels

• Suitable for signal connections in electronic devices

• Used with various PCB configurations in the electrical industry

• Utilised in mechanical systems requiring reliable connectivity

What is the appropriate PCB thickness for optimal performance?

The recommended PCB thickness for this connector is 1.60mm to ensure proper fit and stability during installation.

What are the environmental operating temperature limits for the connector?

It operates effectively within a temperature range of -55°C to +125°C, making it suitable for various industrial applications.

How does the gold plating enhance the connector's performance?

The gold plating on the header connector provides excellent electrical conductivity while also offering resistance to corrosion, ensuring long-lasting functionality.

What is the maximum voltage rating for safe operation?

This connector is rated for a maximum voltage of 350V AC/DC, making it appropriate for numerous electrical applications.

Can this connector be used in high-cycle environments?

Yes, the connector is designed for durability, offering up to 100 mating cycles without degradation in performance, ideal for frequent connections.