Amphenol ICC Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54mm Pitch, 1 Row(s), Unshrouded

The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.

High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.